Materials and devices toward three-dimensional integration

It has been shown that the apparent benefits of a two-layer stacked SOI system, i.e. packing density and speed improvements, are less than could be expected in the context of a VLSI requirement [1]. In this project the stacked SOI system has been identified as having major application in the realization of integrated, mixed technology systems. Zone-melting-recrystallization (ZMR) with lasers and electron beams have been used to produce device quality SOI material and a small test-bed circuit has been designed as a demonstration of the feasibility of this approach. © 1988.

Low-cost PCB-integrated 10-Gb/s optical transceiver built with a novel integration method

A novel integration method for the production of cost-effective optoelectronic printed circuit boards (OE PCBs) is presented. The proposed integration method allows fabrication of OE PCBs with manufacturing processes common to the electronics industry while enabling direct attachment of electronic components onto the board with solder reflow processes as well as board assembly with automated pick-and-place tools. The OE PCB design is based on the use of polymer multimode waveguides, end-fired optical coupling schemes, and simple electro-optic connectors, eliminating the need for additional optical components in the optical layer, such as micro-mirrors and micro-lenses. A proof-of-concept low-cost optical transceiver produced with the proposed integration method is presented. This transceiver is fabricated on a low-cost FR4 substrate, comprises a polymer Y-splitter together with the electronic circuitry of the transmitter and receiver modules and achieves error-free 10-Gb/s bidirectional data transmission. Theoretical studies on the optical coupling efficiencies and alignment tolerances achieved with the employed end-fired coupling schemes are presented while experimental results on the optical transmission characteristics, frequency response, and data transmission performance of the integrated optical links are reported. The demonstrated optoelectronic unit can be used as a front-end optical network unit in short-reach datacommunication links. © 2011-2012 IEEE.

Influence of a building's integrated-photovoltaics on heating and cooling loads

Building integrated photovoltaics (BIPV) has the potential to become a major source of renewable energy in the urban environment. BIPV has significant influence on the heat transfer through the building envelope because of the change of the thermal resistance by adding or replacing the building elements. Four different roofs are used to assess the impacts of BIPV on the building's heating-and-cooling loads; namely ventilated air-gap BIPV, non-ventilated (closed) air-gap BIPV, closeroof mounted BIPV, and the conventional roof with no PV and no air gap. One-dimensional transient models of four cases are derived to evaluate the PV performances and building cooling-and-heating loads across the different roofs in order to select the appropriate PV building integration method in Tianjin, China. The simulation results show that the PV roof with ventilated air-gap is suitable for the application in summer because this integration leads to the low cooling load and high PV conversion efficiency. The PV roof with ventilation air-gap has a high time lag and small decrement factor in comparison with other three roofs and has the same heat gain as the cool roof of absorptance 0.4. In winter, BIPV of non-ventilated air gap is more appropriate due to the combination of the low heating-load through the PV roof and high PV electrical output. © 2005 Elsevier Ltd. All rights reserved.

Formation of silicon-on-insulator layers by electron beam recrystallization

This paper outlines the development of the electron beam recrystallization approach to the formation of silicon-on-insulator layers. The technique of recrystallizing seeded layers by a line electron beam has been widely adopted. Present practice in electron beam recrystallization is reviewed, both from materials and process points of view. Applications of silicon-on-insulator substrates formed in this way are described, particularly in three-dimensional integration. © 1988.

Ready configuration of machines into an existing manufacturing system

This paper focuses on simplifying and easing the integration of a new machine into an existing conventional hierarchical manufacturing system. Based on a distributed manufacturing paradigm, it proposes the functions and interfaces that a new machine and an existing manufacturing system should possess so that ready and simple configuration of additional machines can be achieved. The configuration process is intended to include, not only mechanical and electrical interfaces, but also decision system interfaces (such as planning, scheduling, and shop-floor control). Preliminary laboratory experiments to compare the reconfigurability resulting from a conventional integration method and the proposed distributed method are presented and discussed. © 2007 ISAM.

Polymer-based board-level optical interconnects

This paper provides an overview of the rationale behind the significant interest in polymer-based on-board optical links together with a brief review of recently reported work addressing certain challenges in this field. Polymer-based optical links have garnered considerable research attention due to their important functional attributes and compelling cost-benefit advantages in on-board optoelectronic systems as they can be cost-effectively integrated on conventional printed circuit boards. To date, significant work on the polymer materials, their fabrication process and their integration on standard board substrates have enabled the demonstration of numerous high-speed on-board optical links. However, to be deployed in real-world systems, these optoelectronic printed circuit boards (OE PCBs) must also be cost-effective. Here, recent advances in the integration process focusing on simple direct end-fire coupling schemes and the use of low-cost FR4 PCB substrates are presented. Performance of two proof-of-principle 10 Gb/s systems based on this integration method are summarised while work in realising more complex yet compact planar optical components is outlined. © 2011 IEEE.