The technical potential for reducing metal requirements through lightweight product design

Metal production consumes around 10% of all global energy, so is a significant driver of climate change and other concerns about sustainability. Demand for metal is rising and forecast to double by 2050 through a combination of growing total demand from developing countries, and ongoing replacement demand in developed economies. Metal production is already extremely efficient, so the major opportunities for emissions abatement in the sector are likely to arise from material efficiency - using less new metal to meet demand for services. Therefore this paper examines the opportunity to reduce requirements for steel and aluminium by lightweight design. A set of general principles for lightweight design are proposed by way of a simple analytical example, and are then applied to five case study products which cumulatively account for 30% of global steel product output. It is shown that exploiting lightweight design opportunities for these five products alone could reduce global steel requirements by 5%, and similar savings in aluminium products could reduce global aluminium requirements by 7%. If similar savings to those in the design case studies were possible in all steel and aluminium products, total material requirements could be reduced by 25-30%. However, many of these light-weighting measures are, at present, economically unattractive, and may take many years to implement. © 2011 Elsevier B.V. All rights reserved.

A comparative study of plasma-enhanced chemical vapor gate dielectrics for solution-processed polymer thin-film transistor circuit integration

This paper considers plasma-enhanced chemical vapor deposited (PECVD) silicon nitride (SiNx) and silicon oxide (SiOx) as gate dielectrics for organic thin-film transistors (OTFTs), with solution-processed poly[5, 5′ -bis(3-dodecyl-2-thienyl)-2, 2′ -bithiophene] (PQT-12) as the active semiconductor layer. We examine transistors with SiNx films of varying composition deposited at 300 °C as well as 150 °C for plastic compatibility. The transistors show over 100% (two times) improvement in field-effect mobility as the silicon content in SiNx increases, with mobility (μFE) up to 0.14 cm2 /V s and on/off current ratio (ION / IOFF) of 108. With PECVD SiOx gate dielectric, preliminary devices exhibit a μFE of 0.4 cm2 /V s and ION / IOFF of 108. PQT-12 OTFTs with PECVD SiNx and SiOx gate dielectrics on flexible plastic substrates are also presented. These results demonstrate the viability of using PECVD SiN x and SiOx as gate dielectrics for OTFT circuit integration, where the low temperature and large area deposition capabilities of PECVD films are highly amenable to integration of OTFT circuits targeted for flexible and lightweight applications. © 2008 American Institute of Physics.

Stainless steel sandwich

The Cambridge University's Gordon Laboratory, in collaboration with Fibertech and the Defence Science and Technology Laboratory in the UK, has developed a novel melt spun fiber bore called 'Fibrecore', fabricated entirely from stainless steel with thin faceplates. Fibrecore is typically manufactured by 5mm-long and 70μm thick stainless steel fibers, produced by a melt overflow process. Its entirely metallic construction allows spot welding and tungsten inert gas welding without difficulty. Fibrecore exhibits different energy absorption mechanisms such as core cushioning, core-faceplate delamination, and plastic faceplate deformation, often in a concertina-like fashion. Its low-cost, high structural efficiency and good energy absorption characteristics make it attractive for a range of commercial and military applications. Such applications being evaluated include vehicle body panels, exhaust system noise reduction, low cost filters, and lightweight physical protection. In addition to these characteristics, Fibrecore exhibits properties such as corrosion protection, vibrational damping, and thermal insulation, which also extend its applications.

Convective heat dissipation with lattice-frame materials

This paper presents experimental results on heat transfer and pressure drop for a compact heat sink made of fully triangulated, lightweight (porosity∼0.938), aluminum lattice-frame materials (LFMs). Due to the inherent structural anisotropy of the LFMs, two mutually perpendicular orientations were selected for the measurements. Constant heat flux was applied to the heat sink under steady state conditions, and dissipated by forced air convection. The experimental data were compared with those predicted from an analytical model based on fin analogy. The experimental results revealed that pressure drop is strongly dependent upon the orientation of the structure, due mainly to the flow blockage effect. For heat transfer measurements, typical local temperature distributions on the substrate under constant heat flux conditions were captured with infrared camera. The thermal behavior of LFMs was found to follow closely that of cylinder banks, with early transition Reynolds number (based on strut diameter) equal to about 300. The Nusselt number prediction from the fin-analogy correlates well with experimental measurements, except at low Reynolds numbers where a slightly underestimation is observed. Comparisons with empty channels and commonly used heat exchanger media show that the present LFM heat sink can remove heat approximately seven times more efficient than an empty channel and as efficient as a bank of cylinders at the same porosity level. The aluminum LFMs are extremely stiff and strong, making them ideal candidates for multifunctional structures requiring both heat dissipation and mechanical load carrying capabilities. © 2003 Elsevier Ltd. All rights reserved.