30 resultados para Hot metal
em Cambridge University Engineering Department Publications Database
Resumo:
Highly porous ultralightweight cellular metal foams with open cells have attractive mechanical, thermal, acoustic and other properties and are currently being exploited for high-temperature applications (e.g. acoustic liners for combustion chambers). In such circumstances, thermal radiation in the metal foam becomes a significant mechanism of heat transfer. This paper presents results from experimental measurements on radiative transfer in Fe-Cr-Al-Y (a steel-based high-temperature alloy) foams having high porosity (95 per cent) and different cell sizes, manufactured at low cost from the sintering route. The spectral transmittance and reflectance are measured at different infrared wavelengths ranging from 2.5 to 50 μm, which are subsequently used to determine the extinction coefficient and foam emissivity. The results show that the spectral quantities are strongly dependent on the wavelength, particularly in the short-wavelength regime (less than 25 μm). While the extinction coefficient decreases with increasing cell size, the effect of cell size on foam reflectance is not significant. When the temperature is increased, the total extinction coefficient increases but the total reflectance decreases. The effective radiative conductivity of the metal foam is obtained by using the guarded hot-plate apparatus. With the porosity fixed, the effective radiative conductivity increases with increasing cell size and increasing temperature. © IMechE 2004.
Resumo:
This paper presents a combined experimental and numerical study on natural convection in open-celled metal foams. The effective thermal conductivities of steel alloy (FeCrAlY) samples with different relative densities and cell sizes are measured with the guarded-hot-plate method. To examine the natural convection effect, the measurements are conducted under both vacuum and ambient conditions for a range of temperatures. The experimental results show that natural convection is very significant, accounting for up to 50% of the effective foam conductivity obtained at ambient pressure. This has been attributed to the high porosity (ε > 0.9) and inter-connected open cells of the metal foams studied. Morphological parameters characterizing open-celled FeCrAlY foams are subsequently identified and their cross-relationships are built. The non-equilibrium two-equation energy transfer model is employed, and selected calculations show that the non-equilibrium effect between the solid foam skeleton and air is significant. The study indicates that the combined parameter, i.e., the porous medium Rayleigh number, is no longer appropriate to correlate natural convection by itself when the Darcy number is sufficiently large as in the case of natural convection in open-celled metal foams. Good agreement between model predictions and experimental measurements is obtained. © 2005 Elsevier Ltd. All rights reserved.
Resumo:
This work reports on thermal characterization of SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) MEMS (micro electro mechanical system) gas sensors using a thermoreflectance (TR) thermography system. The sensors were fabricated in a CMOS foundry and the micro hot-plate structures were created by back-etching the CMOS processed wafers in a MEMS foundry using DRIE (deep reactive ion etch) process. The calibration and experimental details of the thermoreflectance based thermal imaging setup, used for these micro hot-plate gas sensor structures, are presented. Experimentally determined temperature of a micro hot-plate sensor, using TR thermography and built-in silicon resistive temperature sensor, is compared with that estimated using numerical simulations. The results confirm that TR based thermal imaging technique can be used to determine surface temperature of CMOS MEMS devices with a high accuracy. © 2010 EDA Publishing/THERMINIC.
Resumo:
To meet targeted reductions in CO 2 emissions by 2050, demand for metal must be cut, for example through the use of lightweight technologies. However, the efficient production of weight optimized components often requires new, more flexible forming processes. In this paper, a novel hot rolling process is presented for forming I-beams with variable cross-section, which are lighter than prismatic alternatives. First, the new process concept is presented and described. A detailed computational and experimental analysis is then conducted into the capabilities of the process. Results show that the process is capable of producing defect free I-beams with variations in web depth of 30-50%. A full analysis of the process then indicates the likely failure modes, and identifies a safe operating window. Finally, the implications of these results for producing lightweight beams are discussed. © 2012 Elsevier B.V. All rights reserved.
Resumo:
Salmonella enterica sv. typhimurium (S. enterica sv. Typhimurium) has two metal-transporting P(1)-type ATPases whose actions largely overlap with respect to growth in elevated copper. Mutants lacking both ATPases over-accumulate copper relative to wild-type or either single mutant. Such duplication of ATPases is unusual in bacterial copper tolerance. Both ATPases are under the control of MerR family metal-responsive transcriptional activators. Analyses of periplasmic copper complexes identified copper-CueP as one of the predominant metal pools. Expression of cueP was recently shown to be controlled by the same metal-responsive activator as one of the P(1)-type ATPase genes (copA), and copper-CueP is a further atypical feature of copper homeostasis in S. enterica sv. Typhimurium. Elevated copper is detected by a reporter construct driven by the promoter of copA in wild-type S. enterica sv. Typhimurium during infection of macrophages. Double mutants missing both ATPases also show reduced survival inside cultured macrophages. It is hypothesized that elevated copper within macrophages may have selected for specialized copper-resistance systems in pathogenic microorganism such as S. enterica sv. Typhimurium.