Solid particle erosion of boronized steels

Boronizing is a thermochemical diffusion-based process for producing iron boride layers in the surface of steel components. The boride layer is wear resistant and is very hard. Large residual stresses are found to exist in the surface layers, which are a function of substrate steel composition and heat treatment. By slow cooling from the boronizing temperature (900°C), a large compressive stress is developed in the boride layer. Hardening the steel by rapid cooling, either directly from the boronizing treatment or after subsequent austenitizing, develops tension in the coating which causes it to fracture. Tempering of the martensite produces compression in the coating, closing but not welding the cracks. The results of solid particle erosion experiments using silicon carbide, quartz, and glass bead erodents on boronized steels are presented.

Millisecond processing beyond chip technology: From electronics to photonics

There is a clear and increasing interest in short time annealing processing far below one second, i.e. the lower limit of Rapid Thermal Processing (RTP) called spike annealing. This was driven by the need of suppressing the so-called Transient Enhanced Diffusion in advanced boronimplanted shallow pn-junctions in silicon technology. Meanwhile the interest in flash lamp annealing (FLA) in the millisecond range spread out into other fields related to silicon technology and beyond. This paper reports on recent experiments regarding shallow junction engineering in germanium, annealing of ITO layers on glass and plastic foil to form an conductive layer as well as investigations which we did during the last years in the field of wide band gap semiconductor materials (SiC, ZnO). A more common feature evolving from our work was related to the modeling of wafer stress during millisecond thermal processing with flash lamps. Finally recent achievements in the field of silicon-based light emission basing on Metal-Oxide-Semiconductor Light Emitting Devices will be reported. © 2007 IEEE.