76 resultados para Copper powder

em Cambridge University Engineering Department Publications Database


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The exponential increase of industrial demand in the past two decades has led scientists to the development of alternative technologies for the fast manufacturing of engineering components, aside from standard and time consuming techniques such as casting or forging.Cold Spray (CS) is a newly developed manufacturing technique, based upon the deposition of metal powder on a substrate due to high energy particle impacts. In this process, the powder is accelerated up to considerable speed in a converging-diverging nozzle, typically using air, nitrogen or helium as a carrier gas. Recent developments have demonstrated significant process capabilities, from the building of mold-free 3D shapes made of various metals, to low porosity and corrosion resistant titanium coatings.In CS, the particle stream characteristics during the acceleration process are important in relation to the final geometry of the coating. Experimental studies have shown the tendency of particles to spread over the nozzle acceleration channel, resulting in a wide exit stream and in the difficulty of producing narrow tracks.This paper presents an investigation on the powder stream characteristics in CS supersonic nozzles. The powder insertion location was varied within the carrier gas flow, along with the geometry of the powder injector, in order to identify their relation with particle trajectories. Computational Fluid Dynamics (CFD) results by Fluent v6.3.26 are presented, along with experimental observations. Different configurations were tested and modeled, giving deposited track geometries of copper and tin ranging from 1. mm to 8. mm in width on metal and polymer substrates. © 2011 Elsevier B.V.

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Salmonella enterica sv. typhimurium (S. enterica sv. Typhimurium) has two metal-transporting P(1)-type ATPases whose actions largely overlap with respect to growth in elevated copper. Mutants lacking both ATPases over-accumulate copper relative to wild-type or either single mutant. Such duplication of ATPases is unusual in bacterial copper tolerance. Both ATPases are under the control of MerR family metal-responsive transcriptional activators. Analyses of periplasmic copper complexes identified copper-CueP as one of the predominant metal pools. Expression of cueP was recently shown to be controlled by the same metal-responsive activator as one of the P(1)-type ATPase genes (copA), and copper-CueP is a further atypical feature of copper homeostasis in S. enterica sv. Typhimurium. Elevated copper is detected by a reporter construct driven by the promoter of copA in wild-type S. enterica sv. Typhimurium during infection of macrophages. Double mutants missing both ATPases also show reduced survival inside cultured macrophages. It is hypothesized that elevated copper within macrophages may have selected for specialized copper-resistance systems in pathogenic microorganism such as S. enterica sv. Typhimurium.

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A pin on cylinder wear rig has been built with precision stepping motor drives to both rotary and axial motions which enable accurate positional control to be achieved. Initial experiments using sapphire indenters running against copper substrates have investigated the build up of a single wear groove by repeated sliding along the same track. An approximate three dimensional ploughing analysis is also presented and the results of theory and experiment compared.