137 resultados para Clay Nanocomposites

em Cambridge University Engineering Department Publications Database


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This paper presents the results from 10 minidrum centrifuge tests conducted at the Schofield Centre, compiled with 4 additional test results from Thusyanthan et al., 2008. All these tests were designed to measure the uplift resistance of a pipeline installed into stiff clay by trenching and backfilling, then uplifted approximately 3 months after installation. All tests were conducted at 1:30 scale using soil obtained from offshore clay samples. Experimental results show that clay blocks remained intact after 3 prototype months of consolidation, and were lifted rather than sheared during pipe pullout. The uplift resistance therefore depends on the weight of the soil cover and the shearing resistance mobilised at the softening contact points between the intact blocks and within the interstitial slurry. Slow drained pullout led to lower resistance than fast pullout, indicating that the drained response is critical for design. The varying scatter shows that peak uplift resistance is very sensitive to the arrangement of the backfill blocks when the cover and pipe diameter are comparable to the block size. Copyright © 2009 by The International Society of Offshore and Polar Engineers (ISOPE).

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Electrohydrodynamic (EHD) pattern formation in carbon nanotube-polymer composite films yields well-defined patterns on the micrometer scale along with the alignment of carbon nanotubes (CNTs) within these patterns. Conductive pathways in nanotube networks formed during EHD patterning of nanocomposite films results in a substantial increase in the composites' conductivity at loadings exceeding the percolation threshold. The degree of nanotube alignment can be tuned by adjusting the EHD parameters and the degree of alignment is mirrored by the conductivity across the film. Using etching techniques or by embedding relatively long nanotubes, patterned surfaces decorated by CNT brushes were generated. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.