2 resultados para COPPER(I) IODIDE

em Cambridge University Engineering Department Publications Database


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A pin on cylinder wear rig has been built with precision stepping motor drives to both rotary and axial motions which enable accurate positional control to be achieved. Initial experiments using sapphire indenters running against copper substrates have investigated the build up of a single wear groove by repeated sliding along the same track. An approximate three dimensional ploughing analysis is also presented and the results of theory and experiment compared.

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Quantitative microbeam Rutherford backscattering (RBS) analysis with a 1.5 MeV 4He+ beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C and jetted onto the glass substrate through a piezoelectric ceramic print head in droplets about 0.5 mm diameter. The substrate temperature was 150 °C. Solid well-formed deposits resulted which have a copper content greater than about 90% by weight. The RBS spectra were analysed objectively using the DataFurnace code, with the assumption that the deposit was CuOx, and the validity of different assumed values of x being tested. The assumptions and the errors of the analysis are critically evaluated. © 2002 Elsevier Science B.V. All rights reserved.