Demonstration of a compact InGaAsP active crosspoint switch operating at 1.5 μm using novel reflective y-coupler components

An extremely compact active optoelectronic crosspoint switch, having overall dimensions of 400 μm×200 μm, is reported. The device provides unity facet-to-facet gain for both bar and cross state operation for TE or TM input signals.

HEAVY VEHICLE VIBRATION - A CASE STUDY.

A method is presented for the digital simulation of multiple degrees-of-freedom lumped parameter vibrating systems with arbitrary constitutive elements in an inertial frame of reference. The geometry of the system is treated independently of the constitutive elements and as a result nonlinear (time domain) or linearised (frequency domain) calculations may be performed using a single input description. The method is used to simulate a 3-axle rigid heavy commercial vehicle for harsh vibrating conditions. Some of the assumptions to which the calculations are sensitive are examined. Agreement between the response of a 3-dimensional whole vehicle model and measurements on the test vehicle is satisfactory.

THEORETICAL ROAD DAMAGE DUE TO DYNAMIC TYRE FORCES OF HEAVY VEHICLES. PART 2: SIMULATED DAMAGE CAUSED BY A TANDEM-AXLE VEHICLE.

The literature relating to road surface failure and design is briefly reviewed and the conventional methods for assessing the road damaging effects of dynamic tire forces are examined. A new time domain technique for analyzing dynamic tire forces and four associated road damage criteria are presented. The force criteria are used to examine the road damaging characteristics of a simple tandem-axle vehicle model for a range of speed and road roughness conditions. It is concluded that for the proposed criteria, the theoretical service life of road surfaces that are prone to fatigue failure may be reduced significantly by the dynamic component of wheel forces. The damage done to approximately five per cent of the road surface area during the passage of a theoretical model vehicle at typical highway speeds may be increased by as much as four times.

Novel architecture to facilitate disassembly and reuse of electronic components and sub-assemblies

This paper advances the proposition that in many electronic products, the partitioning scheme adopted and the interconnection system used to interconnect the sub-assemblies or components are intimately related to the economic benefits, and hence the attractiveness, of reuse of these items. An architecture has been developed in which the residual values of the connectors, components and sub-assemblies are maximized, and opportunities for take-back and reuse of redundant items are greatly enhanced. The system described also offers significant manufacturing cost benefits in terms of ease of assembly, compactness and robustness.