Turbine blade tip heat transfer in low speed and high speed flows

In this paper, high and low speed tip flows are investigated for a high-pressure turbine blade. Previous experimental data are used to validate a CFD code, which is then used to study the tip heat transfer in high and low speed cascades. The results show that at engine representative Mach numbers the tip flow is predominantly transonic. Thus, compared to the low speed tip flow, the heat transfer is affected by reductions in both the heat transfer coefficient and the recovery temperature. The high Mach numbers in the tip region (M>1.5) lead to large local variations in recovery temperature. Significant changes in the heat transfer coefficient are also observed. These are due to changes in the structure of the tip flow at high speed. At high speeds, the pressure side corner separation bubble reattachment occurs through supersonic acceleration which halves the length of the bubble when the tip gap exit Mach number is increased from 0.1 to 1.0. In addition, shock/boundary-layer interactions within the tip gap lead to large changes in the tip boundary-layer thickness. These effects give rise to significant differences in the heat-transfer coefficient within the tip region compared to the low-speed tip flow. Compared to the low speed tip flow, the high speed tip flow is much less dominated by turbulent dissipation and is thus less sensitive to the choice of turbulence model. These results clearly demonstrate that blade tip heat transfer is a strong function of Mach number, an important implication when considering the use of low speed experimental testing and associated CFD validation in engine blade tip design. Copyright © 2009 by ASME.

The impact of government policy on technology transfer: An aircraft industry case study

This case study explores the interaction between domestic and foreign governmental policy on technology transfer with the goal of exploring the long-term impacts of technology transfer. Specifically, the impact of successive licensing of fighter aircraft manufacturing and design to Japan in the development of Japan's aircraft industry is reviewed. Results indicate Japan has built a domestic aircraft industry through sequential learning with foreign technology transfers from the United States, and design and production on domestic fighter aircraft. This process was facilitated by governmental policies in both Japan and the United States. Published by Elsevier B.V.

Thin film coil design considerations for wireless power transfer in flat panel display

Wireless power transfer is experimentally demonstrated by transmission between an AC power transmitter and receiver, both realised using thin film technology. The transmitter and receiver thin film coils are chosen to be identical in order to promote resonant coupling. Planar spiral coils are used because of the ease of fabrication and to reduce the metal layer thickness. The energy transfer efficiency as a function of transfer distance is analysed along with a comparison between the theoretical and the experimental results. © 2012 Materials Research Society.

Shear transfer across a diagonal crack in reinforced concrete strengthened with externally bonded FRP fabric

Aging concrete infrastructure in developed economies and more recently constructed concrete infrastructure in the developing world are frequently found to be deficient in structural strength relative to current needs. This can be attributed to a variety of factors including deterioration, construction defects, accidental damage, changes in understanding and failure to design for future loading requirements. Strengthening existing concrete structures can be a cost and carbon effective alternative to replacement. A competitive option for the strengthening of concrete slab-on-beam structures that are deficient in shear capacity is the U-wrapping of the down-stand beam portion of the shear span with externally bonded FRP fabric. While guidance exists for the strengthening of reinforced concrete by U-wrapping, the interaction between internal steel reinforcement, concrete and external FRP in the presence of a dominant diagonal shear crack is not well understood. An approach adopted in previous work has been to explore this interaction through conventional push-off testing. In conventional push-off testing, unlike in a beam, the shear plane is parallel to the direction of loading and perpendicular to the principal fibre orientation. This paper presents a novel push-off test variation in which the shear plane is inclined at 45° to the direction of loading and the principal fibre orientation. A variety of reinforcement ratios, FRP thicknesses and FRP end conditions are modelled. The implications of inclined cracking on debonding of FRP are investigated. The suitability and relevance of inclined push-off tests for further work in this area is also assessed. © 2013, NetComposite Limited.

Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates

The transfer printing of 2 μm-thick aluminum indium gallium nitride (AlInGaN) micron-size light-emitting diodes with 150 nm (±14 nm) minimum spacing is reported. The thin AlInGaN structures were assembled onto mechanically flexible polyethyleneterephthalate/polydimethylsiloxane substrates in a representative 16 × 16 array format using a modified dip-pen nano-patterning system. Devices in the array were positioned using a pre-calculated set of coordinates to demonstrate an automated transfer printing process. Individual printed array elements showed blue emission centered at 486 nm with a forward-directed optical output power up to 80 μW (355 mW/cm 2) when operated at a current density of 20 A/cm2. © 2013 AIP Publishing LLC.

Precision transfer printing of ultra-thin AlInGaN micron-size light-emitting diodes

We report the fabrication of a mechanically-flexible 16×16 array of thin-film, micron-size LEDs emitting at 480 nm. Devices were transfer-printed onto a mechanically-flexible ITO backplane using a modified, high-precision (placement accuracy ±25 nm) assembly system. © 2013 IEEE.