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This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.

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A novel monolithically integrated Michelson interferometer using intersecting twin-contact semiconductor optical amplifiers is proposed and implemented whereby the two arms are gain imbalanced to give enhanced noise suppression. Experimental OSNR improvements of 8.4 dB for pulses with durations 8 ps and by default ER of 14 dB are demonstrated for low driving currents of between 25 and 30 mA. This is believed to be the smallest Michelson interferometer to date.

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We experimentally show that a hybrid-integrated Mach-Zehnder switch with a high performance gate profile allows retiming of optical signals with an accuracy of 500-700fs even if the input timing jitter is increased to 3ps. © 2004 Optical Society of America.

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The first demonstration of a directly modulated microring laser array is presented for on-off keyed, wavelength- division- multiplexed fiber-optic data transmission. GaInAsP-InP microring resonators oscillating at separate wavelengths in the 1.5-μm band are vertically coupled to a common passive waveguide bus, which is fabricated on the reverse side of the InP membrane. Two microrings defined with radii for a wavelength channel separation of 6 nm have been assessed for both individual and simultaneous operation. Negligible power penalty (<0.2 dB) is observed for wavelength-division-multiplexed operation with and without transmission over a 25-km fiber span in a manner which indicates low crosstalk between the integrated sources. A device area of less than 0.12 mm2 per microring on a common passive bus allows a highly scalable solution for short-reach wavelength-multiplexed links. © 2008 IEEE.