A study of the configurations of boron in silicon using an empirical approach

The configuration space of boron in silicon has been investigated using an empirical potential approach. This study indicates that energetically favourable configurations consist of a number of three-fold coordinated split interstitials. A configuration consisting of a four-fold boron-interstitial in combination with a two-fold silicon is found to be perfectly aligned in the <111> direction. This configuration in the positive charge state is a possibility for the boron interstitial related defect found via EPR and DLTS. © 1994.

RESIDUAL DEFECTS FOLLOWING RAPID ANNEALING OF BORON IMPLANTED SILICON WITH AND WITHOUT PREAMORPHISATION BY SILICON IMPLANTATION.

Implants of boron into silicon which has been made amorphous by silicon implantation have a shallower depth profile than the same implants into silicon. This results in higher activation and restricted diffusion of the B implants after annealing, and there are also significant differences in the microstructure after annealing compared with B implants into silicon. Rapid isothermal heating with an electron beam and furnace treatments are used to characterize the defect structure as a function of time and temperature. Defects are seen to influence the diffusion of non-substitutional boron.

MECHANISMS OF ABRASIVE WEAR IN A BORONIZED ALLOY STEEL.

This paper describes the effects of abrasive hardness and size on the 2-body abrasive wear mechanisms of a boronized low alloy steel. It is found that the wear resistance of the boronized steel is much greater against alumina abrasive than against silicon carbide. This difference in wear resistance is much enhanced when the particle size or the applied load is increased. Scanning electron microscopy of the worn specimens and of the used abrasive papers revealed that the enhanced difference in wear resistance between coarse alumina and silicon carbide papers is due to a change in the wear mechanism produced by silicon carbide papers with increasing abrasive particle size.

Abrasive wear of steel during rolling-sliding contact with rock counterfaces

In many mining operations (e.g. excavation, drilling, tunnelling, rock crushing) metallic components are forced against abrasive rocks in a complex motion. This study examines the relative importance of combined rolling and sliding motion in the two-body abrasive wear of a low carbon tempered martensitic steel against rock counterfaces. A novel wear test rig has been used to vary the amount of rolling and sliding motion between a rotating steel cylinder and a counter-rotating sandstone (highly abrasive) or limestone (much less abrasive) disc. Weight-loss measurements reveal that the wear rate of the steel increases as the amount of motion against the rock counterface is reduced from pure sliding to approximately 50% sliding (and approximately 50% rolling). Scanning electron microscopy shows that when the amount of motion is reduced from pure sliding to approximately 50% sliding the topographical and sub-surface physical properties of the worn steel and rock surfaces are modified.

Influence of particle properties on the erosive wear of sintered boron carbide

Sintered boron carbide is very hard, and can be an attractive material for wear-resistant components in critical applications. Previous studies of the erosion of less hard ceramics have shown that their wear resistance depends on the nature of the abrasive particles. Erosion tests were performed on a sintered boron carbide ceramic with silica, alumina and silicon carbide erodents. The different erodents caused different mechanisms of erosion, either by lateral cracking or small-scale chipping; the relative values of the hardness of the erodent and the target governed the operative mechanism. The small-scale chipping mechanism led to erosion rates typically an order of magnitude lower than the lateral fracture mechanism. The velocity exponents for erosion in the systems tested were similar to those seen in other work, except that measured with the 125 to 150 μm silica erodent. With this erodent the exponent was initially high, then decreased sharply with increasing velocity and became negative. It was proposed that this was due to deformation and fragmentation of the erodent particles. In the erosion testing of ceramics, the operative erosion mechanism is important. Care must be taken to ensure that the same mechanism is observed in laboratory testing as that which would be seen under service conditions, where the most common erodent is silica.

Friction and material transfer in micro-scale sliding contact between aluminium alloy and steel

A ball-on-flat reciprocating micro-tribometer has been used to measure the friction coefficient between aluminium alloy strip and a steel ball. A relatively small ball and correspondingly low contact load is used to give a contact width of the order of 100μm, closer to asperity contact widths than generally found for this type of test. The effects of load, initial strip surface roughness, lubricants and boundary additives are investigated. It is found that the friction coefficient is significantly reduced by the addition of a lubricant. Observations of the wear tracks and ball surface show that the material transfer from aluminium to the ball is reduced in the presence of the lubricant. The initial friction coefficient is further reduced by the addition of a boundary additive, but the friction coefficient after 8 cycles is unchanged. Copyright © 2004 by Springer Science+Business Media, Inc.

A packaging technique for silicon MEMS strain sensors on steel

A packaging technique suited to applying MEMS strain sensors realized on a silicon chip to a steel flat surface is described. The method is based on adhesive bonding of the silicon chip rear surface on steel using two types of glue normally used for standard piezoresistive strain sensors (Mbond200/ 600), using direct wire bonding of the chip to a Printed Circuit Board, also fixed on steel. In order to protect the sensor from the external environment, and to improve the MEMS performance, the silicon chip is encapsulated with a metal cap hermetically sealed-off under vacuum condition with a vacuum adhesive in which the bonding wires are also protected from possible damage. In order to evaluate the mechanical coupling of the silicon chip with the bar and thestress transfer extent to the silicon surface, commercial strain sensors have been applied on the chip glued on a steel bar in alaboratory setup able to generate strain by inflection, yielding a stress transfer around 70% from steel to silicon. © 2008 IEEE.