Overview and status of bottom-up silicon nanowire electronics

This review summarises the recent advances in the field of silicon nanowire electronics from bottom-up assembled materials. The aim is to draw a comparison between bottom-up and top-down approaches, examining respective achievements and evaluating advantages and disadvantages of each methodology. Existing techniques for synthesis and doping are discussed to provide the framework in which practical electronic applications can be developed. Next, key device categories are reviewed, emphasising current challenges and proposed solutions. Finally, field perspectives are outlined. © 2012 Elsevier Ltd.

Printed red-green-blue liquid crystal lasers

We present printable laser devices formed by dispersing dye-doped chiral nematic liquid crystals in solution-processible polymers. Unlike current technology, this allows lasers to be formed on a wide variety of surfaces, e.g. paper, plastic, metal. © 2012 OSA.

LES of heat transfer in electronics

Numerical methods based on the Reynolds Averaged Navier-Stokes (RANS) and Large Eddy Simulation (LES) equations are applied to the thermal prediction of flows representative of those found in and around electronics systems and components. Low Reynolds number flows through a heated ribbed channel, around a heated cube and within a complex electronics system case are investigated using linear and nonlinear LES models, hybrid RANS-LES and RANS-Numerical-LES (RANS-NLES) methods. Flow and heat transfer predictions using these techniques are in good agreement with each other and experimental data for a range of grid resolutions. Using second order central differences, the RANS-NLES method performs well for all simulations. © 2011 Elsevier Inc.

Strategies for modeling turbulent flows in electronics

Hybrid methods based on the Reynolds Averaged Navier Stokes (RANS) equations and the Large Eddy Simulation (LES) formulation are investigated to try and improve the accuracy of heat transfer and surface temperature predictions for electronics systems and components. Two relatively low Reynolds number flows are studied using hybrid RANS-LES, RANS-Implicit-LES (RANS-ILES) and non-linear LES models. Predictions using these methods are in good agreement with each other, even using different grid resolutions. © 2008 IEEE.

Review of computational aeroacoustics for application in electronics cooler noise

A review of computational aeroacoustics (CCA) was made for application in electronics cooler noise. Computational aeroacoustics encompasses all numerical methods where the purposes is to predict the noise emissions from a simulated flow. Numerical simulation of the flow inside and around heat sinks and fans can lead to a prediction of the emitted noise while they are still in the design phase. Direct CCA is theoretically the best way to predict flow-based acoustic phenomena numerically. It is typically used only for low-frequency sound prediction. The boundary element method offers low computational cost and does not use a computational grid, but instead use vortex-surface calculations to determine tonal noise. Axial fans are commonly used to increase the airflow and thus the heat transfer over the heat sinks within the computer cases. Very detailed source simulations in the fan and heat sink region coupled with the use of analogy methods could result in excellent simulation results with a reasonable computational effort.