Investigation of anti-lock braking strategies for heavy goods vehicles

An articulated lorry was instrumented in order to measure its performance in straight-line braking. The trailer was fitted with two interchangeable tandem axle sub-chassis, one with an air suspension and the other with a steel monoleaf four-spring suspension. The brakes were only applied to the trailer axles, which were fitted with anti-lock braking systems (ABS), with the brake torque controlled in response to anticipated locking of the leading axle of the tandem. The vehicle with the air suspension was observed to have significantly better braking performance than the steel suspension, and to generate smaller inter-axle load transfer and smaller vertical dynamic tyre forces. Computer models of the two suspensions were developed, including their brakes and anti-lock systems. The models were found to reproduce most of the important features of the experimental results. It was concluded that the poor braking performance of the steel four-spring suspension was mainly due to interaction between the ABS and inter-axle load transfer effects. The effect of road roughness was investigated and it was found that vehicle stopping distances can increase significantly with increasing road roughness. Two alternative anti-lock braking control strategies were simulated. It was found that independent sensing and actuation of the ABS system on each wheel greatly reduced the difference in stopping distances between the air and steel suspensions. A control strategy based on limiting wheel slip was least susceptible to the effects of road roughness.

Preparation of tetrahedral amorphous carbon films by filtered cathodic vacuum arc deposition

Tetrahedrally bonded amorphous carbon (ta-C) and nitrogen doped (ta-C:N) films were obtained at room temperature in a filtered cathodic vacuum arc (FCVA) system incorporating an off-plane double bend (S-bend) magnetic filter. The influence of the negative bias voltage applied to substrates (from -20 to -350 V) and the nitrogen background pressure (up to 10-3 Torr) on film properties was studied by scanning electron microscopy (SEM), electron energy loss spectroscopy (EELS), Raman spectroscopy, X-ray photoemission spectroscopy (XPS), secondary ion mass spectroscopy (SIMS) and X-ray reflectivity (XRR). The ta-C films showed sp3 fractions between 84% and 88%, and mass densities around 3.2 g/cm3 in the wide range of bias voltage studied. In contrast, the compressive stress showed a maximum value of 11 GPa for bias voltages around -90 V, whereas for lower and higher bias voltages the stress decreased to 6 GPa. As for the ta-C:N films grown at bias voltages below -200 V and with N contents up to 7%, it has been found that the N atoms were preferentially sp3 bonded to the carbon network with a reduction in stress below 8 GPa. Further increase in bias voltage or N content increased the sp2 fraction, leading to a reduction in film density to 2.7 g/cm3.

Low field electron emission from nanoclustered carbon grown by cathodic arc

Nanocluster carbon films grown using a cathodic arc process at room temperature in the presence of background gases such as helium are found to be good electron emitters. The variation in the surface morphology and the corresponding emission characteristics of the films with change in helium partial pressure (5×10-4 to 50 Torr) during film growth are reported. The effect of helium partial pressure on clustering was studied for films grown at nitrogen partial pressures of 10-4 and 10-3 Torr. The surface morphology of the films varied from smooth through clusters (with sizes 50-200 nm) to fibrous films. The threshold field varied from 1 to 10 V/μm for an emission current density 1 μA/cm2.

Short-channel polymer field-effect-transistor fabrication using spin-coating-induced edge template and ink-jet printing

A method to fabricate polymer field-effect transistors with submicron channel lengths is described. A thin polymer film is spin coated on a prepatterned resist with a low resolution to create a thickness contrast in the overcoated polymer layer. After plasma and solvent etching, a submicron-sized line structure, which templates the contour of the prepattern, is obtained. A further lift-off process is applied to define source-drain electrodes of transistors. With a combination of ink-jet printing, transistors with channel length down to 400 nm have been fabricated by this method. We show that drive current density increases as expected, while the on/off current ratio 106 is achieved. © 2005 American Institute of Physics.