Air stable complementary polymer circuits fabricated in ambient condition by inkjet printing

Air stable complementary polymer inverters were demonstrated by inkjet printing of both top-gate electrodes and the semiconductors in ambient conditions. The p-type and n-type polymer semiconductors were also thermally annealed in ambient conditions after printing. The good performance of circuits in ambient condition shows that the transistors are not only air-stable in term of ambient humidity and oxygen, but also inert to ion migration through dielectrics from the printed gate. The result obtained here has further confirmed the feasibility of fabrication of low-cost polymer complementary circuits in a practical environment. © 2011 Elsevier B.V. All rights reserved.

The use of centrifuge tests in the study of arching

The horizontal arching mechanism transfers horizontal earth pressures acting on flexible retaining wall panels to stiffer neighbouring elements via soil shear stresses. In this research, the horizontal arching mechanism and lateral displacements of fixed cantilever walls in a model basement are investigated using centrifuge tests. A series of six tests was carried out at 45 gravities where the panel widths and thicknesses around the model basement were varied, so that the effects of panel geometry and stiffness on horizontal arching could be studied. It is shown that panel crest displacements and base bending moments of the most flexible, narrow panels can be an order of magnitude smaller than conventional active earth pressure calculations would allow. It is suggested that the reduction of earth pressure acting on a panel is directly correlated to the mobilized soil shear strength and hence, soil shear strain. Earth pressure coefficients K are plotted against panel displacements normalized by the panel width, u/B, to simulate the reduction of K with increasing soil strain.An idealized K-u/B curve is introduced, characterised by a reference distortion (u/B) ref beyond which fully plastic soil arching can be inferred, and which is related to the corresponding reference shear strain γ ref at which soil strength is fully mobilized in element tests. © 2006 Taylor & Francis Group, London.

Complementary metal-oxide-semiconductor-compatible and self-aligned catalyst formation for carbon nanotube synthesis and interconnect fabrication

We have for the first time developed a self-aligned metal catalyst formation process using fully CMOS (complementary metal-oxide-semiconductor) compatible materials and techniques, for the synthesis of aligned carbon nanotubes (CNTs). By employing an electrically conductive cobalt disilicide (CoSi 2) layer as the starting material, a reactive ion etch (RIE) treatment and a hydrogen reduction step are used to transform the CoSi 2 surface into cobalt (Co) nanoparticles that are active to catalyze aligned CNT growth. Ohmic contacts between the conductive substrate and the CNTs are obtained. The process developed in this study can be applied to form metal nanoparticles in regions that cannot be patterned using conventional catalyst deposition methods, for example at the bottom of deep holes or on vertical surfaces. This catalyst formation method is crucially important for the fabrication of vertical and horizontal interconnect devices based on CNTs. © 2012 American Institute of Physics.

Case study on a deep excavation in soft ground by centrifuge model tests

This paper provides a case study on the deepest excavation carried out so far in the construction of the metro network in Shanghai, which typically features soft ground. The excavation is 38 m deep with retaining walls 65 m deep braced by 9 levels of concrete props. To obtain a quick and rough prediction, two centrifuge model tests were conducted, in which one is for the 'standard' section with green field surrounding and the other with an adjacent piled building. The tests were carried out in a run-stop-excavation-run style, in which excavation was conducted manually. By analyzing the lateral wall displacement, ground deformation, bending moment and earth pressure, the test results are shown to be reasonably convincing and the design and construction were validated. Such industry orientated centrifuge modeling was shown to be useful in understanding the performance of geotechnical processes, especially when engineers lack relevant field experience. © 2010 Taylor & Francis Group, London.

Dynamic centrifuge tests on shallow tunnel models in dry sand

In the framework of the Italian research project ReLUIS-DPC, a set of centrifuge tests were carried out at the Schofield Centre in Cambridge (UK) to investigate the seismic behaviour of tunnels. Four samples of dry sand were prepared at different densities, in which a small scale model of circular tunnel was inserted, instrumented with gauges measuring hoop and bending strains. Arrays of accelerometers in the soil and on the box allowed the amplification of ground motion to be evaluated; LVDTs measured the soil surface settlement. This paper describes the main results of this research, showing among others the evolution of the internal forces during the model earthquakes at significant locations along the tunnel lining. © 2010 Taylor & Francis Group, London.

Particle Image Velocimetry analysis in dynamic centrifuge tests

The Particle Image Velocimetry (PIV) technique is an image processing tool to obtain instantaneous velocity measurements during an experiment. The basic principle of PIV analysis is to divide the image into small patches and calculate the locations of the individual patches in consecutive images with the help of cross correlation functions. This paper focuses on the application of the PIV analysis in dynamic centrifuge tests on small scale tunnels in loose, dry sand. Digital images were captured during the application of the earthquake loading on tunnel models using a fast digital camera capable of taking digital images at 1000 frames per second at 1 Megapixel resolution. This paper discusses the effectiveness of the existing methods used to conduct PIV analyses on dynamic centrifuge tests. Results indicate that PIV analysis in dynamic testing requires special measures in order to obtain reasonable deformation data. Nevertheless, it was possible to obtain interesting mechanisms regarding the behaviour of the tunnels from PIV analyses. © 2010 Taylor & Francis Group, London.

One step self-aligned multilayer patterning process for the fabrication of organic complementary circuits in combination with inkjet printing

Recent development of solution processable organic semiconductors delineates the emergence of a new generation of air-stable, high performance p- and n-type materials. This makes it indeed possible for printed organic complementary circuits (CMOS) to be used in real applications. The main technical bottleneck for organic CMOS to be adopted as the next generation organic integrated circuit is how to deposit and pattern both p- and n-type semiconductor materials with high resolutions at the same time. It represents a significant technical challenge, especially if it can be done for multiple layers without mask alignment. In this paper, we propose a one-step self-aligned fabrication process which allows the deposition and high resolution patterning of functional layers for both p- and n-channel thin film transistors (TFTs) simultaneously. All the dimensional information of the device components is featured on a single imprinting stamp, and the TFT-channel geometry, electrodes with different work functions, p- and n-type semiconductors and effective gate dimensions can all be accurately defined by one-step imprinting and the subsequent pattern transfer process. As an example, we have demonstrated an organic complementary inverter fabricated by 3D imprinting in combination with inkjet printing and the measured electrical characteristics have validated the feasibility of the novel technique. © 2012 Elsevier B.V. All rights reserved.

Tests for conceptual design of 6.6 kV class superconducting fault current limiter with YBCO thin film elements

A superconducting fault current limiter (SFCL) for 6.6 kV and 400 A installed in a cubicle for a distribution network substation was conceptually designed. The SFCL consists of parallel- and series-connected superconducting YBCO elements and a limiting resistor. Before designing the SFCL, some tests were carried out. The width and length of each element used in the tests are 30 mm and 210 mm, respectively. The element consists of YBCO thin film of about 200 nm in thickness on cerium dioxide (CeO2) as a cap-layer on a sapphire substrate by metal-organic deposition with a protective metal coat. In the tests, characteristics of each element, such as over-current, withstand-voltage, and so on, were obtained. From these characteristics, series and parallel connections of the elements, called units, were considered. The characteristics of the units were obtained by tests. From the test results, a single phase prototype SFCL was manufactured and tested. Thus, an SFCL rated at 6.6 kV and 400 A can be designed. © 2009 IEEE.

Seismic analyses of shallow tunnels by dynamic centrifuge tests and finite elements

The increments of internal forces induced in a tunnel lining during earthquakes can be assessed with several procedures at different levels of complexity. However, the substantial lack of well-documented case histories still represents a difficulty in order to validate any of the methods proposed in literature. To bridge this gap, centrifuge model tests were carried out on a circular aluminium tunnel located at two different depths in dense and loose dry sand. Each model has been instrumented for measuring soil motion and internal loads in the lining and tested under several dynamic input signals. The tests performed represented an experimental benchmark to calibrate dynamic analyses with different approaches to account for soil-tunnel kinematic interaction. © 2009 IOS Press.