Diode laser pumped, KERR phase-shifting and switching of a diode laser signal in a small area optical fibre

In this paper authors report the first demonstration of a diode laser powered Kerr effect device, consisting of a single birefringent fiber, able to phase-shift and switch an optical signal generated by a second laser diode. They have obtained fast, stable phase-shifting of 90° in a single fiber, at a coupled pump power of only 20 mW. Using this phase shift to induce polarization switching with resultant gating, 25% modulation of the diode laser signal has been observed, with a detection limited-rise time of 10ns.

158-microJ pulses from a single-transverse-mode, large-mode-area erbium-doped fiber amplifier.

We report the amplification of 10-100-pJ semiconductor diode pulses to an energy of 158 microJ and peak powers >100 kW in a multistage fiber amplifier chain based on a single-mode, large-mode-area erbium-doped amplifier design. To our knowledge these results represent the highest single-mode pulse energy extracted from any doped-fiber system.

158-μJ pulses from a single-transverse-mode, large-mode-area erbium-doped fiber amplifier

We report the amplification of 10-100-pJ semiconductor diode pulses to an energy of 158 μJ and peak powers >100 kW in a multistage fiber amplifier chain based on a single-mode, large-mode-area erbium-doped amplifier design. To our knowledge these results represent the highest single-mode pulse energy extracted from any doped-fiber system. © 1997 Optical Society of America.

Stepped gate polysilicon thin film transistor for large area power applications

For the first time, we report a new poly-Si stepped gate Thin Film Transistor (SG TFT) on glass. The Density of States extracted from measured I-V characteristics has been used to evaluate the device performance with a two dimensional device simulator. The results show that the three-terminal SG TFT device has a switching speed comparable to a low voltage structure and the high on-current capability of a metal field plate (MFP) TFT and the potential for comparable breakdown characteristics.

Physical modelling of large area 4H-SiC PiN diodes

The recent developments in SiC PiN diode research mean that physics-based models that allow accurate, rapid prediction of switching and conduction performance and resulting converter losses will soon be required. This is especially the case given the potential for very high voltage converters to be used for enabling distributed and renewable power generation. In this work an electro-thermal compact model of a 4.5 kV silicon carbide PiN diode has been developed for converter loss modelling in Simulink. Good matching of reverse recovery has been achieved between 25 and 200 °C. The I-V characteristics of the P+ anode contact have been shown to be significant in obtaining good matching for the forward characteristics of the diode, requiring further modelling work in this area. © 2009 IEEE.

Design and process selection for joints in flexible materials

The application of high performance textiles has grown significantly in the last 10 to 15 years. Various research groups throughout the United Kingdom, such as the Department of Trade and Industry, have identified technical textiles as a field for future development. There is little design guidance for joining of flexible materials or general property models that can be applied to theses materials. This lack is due to the large diversity of properties, structures and resulting behaviours of the materials that are classified as "Flexible Materials". This dissertation explores the issues that are involved in characterising the materials at the fibre, bulk and textile levels. Different units of measurement are used for each stage of the manufacturing process of flexible materials and this disparity creates problems when trying to make general comparisons (e.g. comparing textiles to polymer films). Thus, a possible solution to this is to create selection charts that allow designers to compare the strength of materials for a given mass per unit area. A design tool was created using the Cambridge Engineering Selector (CES) software to enable the selection of joining processes for material. The tool is effective in selecting a reduced number of viable joining processes. Through case studies it was shown that designers are required to examine the selected processes (identified by the software) in greater detail - in particular the economics and geometry of the joint - in order to identify the optimum joining process.

Transmission performance of adaptively modulated optical OFDM modems using subcarrier modulation over SMF IMDD links for access and metropolitan area networks.

Detailed investigations are undertaken, for the first time, of the transmission performance of recently proposed novel Adaptively Modulated Optical OFDM (AMOOFDM) modems using Subcarrier Modulation (AMOOFDM-SCM) in single-channel, SMF-based IMDD links without optical amplification and chromatic dispersion compensation. The cross-talk effect induced by beatings among subcarriers of various types is a crucial factor limiting the maximum achievable AMOOFDM-SCM performance. By applying single sideband modulation and/or spectral gapping to AMOOFDM-SCM, three AMOOFDM-SCM designs of varying complexity are proposed, which achieve >60Gb/s signal transmission over 20 km, 40 km and 60 km. Such performances are >1.5 times higher than those supported by conventional AMOOFDM modems.

High-efficiency InGaN/GaN quantum well structures on large area silicon substrates

The growth techniques which have enabled the realization of InGaN-based multi-quantum-well (MQW) structures with high internal quantum efficiencies (IQE) on 150mm (6-in.) silicon substrates are reviewed. InGaN/GaN MQWs are deposited onto GaN templates on large-area (111) silicon substrates, using AlGaN strain-mediating interlayers to inhibit thermal-induced cracking and wafer-bowing, and using a SiN x interlayer to reduce threading dislocation densities in the active region of the MQW structure. MQWs with high IQE approaching 60% have been demonstrated. Atomic resolution electron microscopy and EELS analysis have been used to study the nature of the important interface between the Si(111) substrate and the AlN nucleation layer. We demonstrate an amorphous SiN x interlayer at the interface about 2nm wide, which does not, however, prevent good epitaxy of the AlN on the Si(111) substrate. Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.