63 resultados para microwave packaging


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This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/μ), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes. © 2013 IEEE.

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A compact microwave phase shifter was designed and fabricated using highly anisotropic liquid crystals (LCs). It comprises a thin LC layer between a ground plane and a directly coupled and inverted microstrip line. The proposed folding configuration is beneficial for size reduction. Both simulation and experimental results confirm the compact size devices with reasonably good performance.