Efficient statistical electromagnetic analysis in reverberant environments

This paper presents a statistical approach to the electromagnetic analysis of a system that lies within a reverberant cavity that has random or uncertain properties. The need to solve Maxwell's equations within the cavity is avoided by employing a relation known as the diffuse field reciprocity principle, which leads directly to the ensemble mean squared response of the system; all that is required is the impedance matrix of the system associated with radiation into infinite space. The general theoretical approach is presented, and the analysis is then applied to a five-cable bundle in a reverberation room © 2013 EMC Europe Foundation.

Large-payload climbing in complex vertical environments using thermoplastic adhesive bonds

Despite many approaches proposed in the past, robotic climbing in a complex vertical environment is still a big challenge. We present here an alternative climbing technology that is based on thermoplastic adhesive (TPA) bonds. The approach has a great advantage because of its large payload capacity and viability to a wide range of flat surfaces and complex vertical terrains. The large payload capacity comes from a physical process of thermal bonding, while the wide applicability benefits from rheological properties of TPAs at higher temperatures and intermolecular forces between TPAs and adherends when being cooled down. A particular type of TPA has been used in combination with two robotic platforms, featuring different foot designs, including heating/cooling methods and construction of footpads. Various experiments have been conducted to quantitatively assess different aspects of the approach. Results show that an exceptionally high ratio of 500% between dynamic payloads and body mass can be achieved for stable and repeatable vertical climbing on flat surfaces at a low speed. Assessments on four types of typical complex vertical terrains with a measure, i.e., terrain shape index ranging from -0.114 to 0.167, return a universal success rate of 80%-100%. © 2004-2012 IEEE.