114 resultados para LOW-COST ADSORBENTS


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Rogowski transducers have become an increasingly popular method of measuring current within prototyping applications and power electronics equipment due to their significant advantages compared to an equivalent current transformer. This paper presents a simple and practical construction technique of high-performance, low-cost Rogowski transducers and accompanying circuitry. Experimental tests were carried out to show the validity of the proposed construction technique. © 2005 IEEE.

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A novel integration method for the production of cost-effective optoelectronic printed circuit boards (OE PCBs) is presented. The proposed integration method allows fabrication of OE PCBs with manufacturing processes common to the electronics industry while enabling direct attachment of electronic components onto the board with solder reflow processes as well as board assembly with automated pick-and-place tools. The OE PCB design is based on the use of polymer multimode waveguides, end-fired optical coupling schemes, and simple electro-optic connectors, eliminating the need for additional optical components in the optical layer, such as micro-mirrors and micro-lenses. A proof-of-concept low-cost optical transceiver produced with the proposed integration method is presented. This transceiver is fabricated on a low-cost FR4 substrate, comprises a polymer Y-splitter together with the electronic circuitry of the transmitter and receiver modules and achieves error-free 10-Gb/s bidirectional data transmission. Theoretical studies on the optical coupling efficiencies and alignment tolerances achieved with the employed end-fired coupling schemes are presented while experimental results on the optical transmission characteristics, frequency response, and data transmission performance of the integrated optical links are reported. The demonstrated optoelectronic unit can be used as a front-end optical network unit in short-reach datacommunication links. © 2011-2012 IEEE.

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The use of large size Si substrates for epitaxy of nitride light emitting diode (LED) structures has attracted great interest because Si wafers are readily available in large diameter at low cost. In addition, such wafers are compatible with existing processing lines for the 6-inch and larger wafer sizes commonly used in the electronics industry. With the development of various methods to avoid wafer cracking and reduce the defect density, the performance of GaN-based LED and electronic devices has been greatly improved. In this paper, we review our methods of growing crack-free InGaN-GaN multiple quantum well (MQW) LED structures of high crystalline quality on Si(111) substrates. The performance of processed LED devices and its dependence on the threading dislocation density were studied. Full wafer-level LED processing using a conventional 6-inch III-V processing line is also presented, demonstrating the great advantage of using large-size Si substrates for mass production of GaN LED devices.

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An optical waveguide sensor formed directly on low-cost PCB substrates is presented for the first time. The device integrates polymer waveguides functionalized with chemical dyes, photonic and electronic components and allows multiple-gas detection. © OSA/CLEO 2011.

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4 bps/Hz 40 Gb/s carrierless amplitude and phase (CAP) modulation is investigated for nextgeneration datacommunication links. The 40 Gb/s link achieves double the length of a conventional NRZ scheme, despite using a low-bandwidth source. © OSA/OFC/NFOEC 2011.

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A code-label recognition time of less than 500ps is demonstrated using low-cost FIRfilters. The electronically-processed label provides a control signal from an auto-correlated label. Error-free electronic code-label switching of an optical 10Gb/s signal is demonstrated. © 2010 Optical Society of America.

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Carrierless amplitude and phase modulation for next-generation datacommunication links is considered for the first time. Low-cost implementation of a high-spectral-efficiency 10 Gb/s channel is demonstrated as a route to links at 40 Gb/s and beyond. © 2010 Optical Society of America.

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This paper describes electronically processed CDMA techniques which allow Gb/s data rates for each user in passive optical networks. We will present recent progress including a 16 chip Walsh-code system operating at 18 Gchip/s supporting up to 16 users. © 2009 IEEE.

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We demonstrate a 10 x 10 Gb/s uncooled DWDM system using orthogonal coding on adjacent carriers, assuming the use of a monolithically integrated sources. A power saving of 72% is expected over traditional WDM. © 2014 OSA.

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An APD is shown to improve the noise figure of a lossy optical link compared to a PIN-TIA combination of equivalent gain. Transmission of IEEE 802.11g WLAN signals is demonstrated with 18dB optical link loss. © 2009 Optical Society of America.

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The field of nuclear medicine is reliant on radionuclides for medical imaging procedures and radioimmunotherapy (RIT). The recent shut-downs of key radionuclide producers have highlighted the fragility of the current radionuclide supply network, however. To ensure that nuclear medicine can continue to grow, adding new diagnostic and therapy options to healthcare, novel and reliable production methods are required. Siemens are developing a low-energy, high-current - up to 10MeV and 1mA respectively - accelerator. The capability of this low-cost, compact system for radionuclide production, for use in nuclear medicine procedures, has been considered.