Corporate document mining for technology intelligence: An analysis of needs, utilization and possibilities

This paper focuses on document data, one of the most significant sources for technology intelligence. To help organisations use their knowledge in documents effectively, this research aims to identify what organizations really want from documents and what might be possible to obtain from them. The research involves a literature review, a series of in-depth/on-site interviews and a descriptive analysis of document mining applications. The output of the research includes: a document mining framework; an analysis of the current condition of document mining in technology-based organisations together with their future requirements; and guidelines for introducing document mining into an organisation along with a discussion on the practical issues that are faced by users. Copyright © 2011 Inderscience Enterprises Ltd.

Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect

Board-level optical links are an attractive alternative to their electrical counterparts as they provide higher bandwidth and lower power consumption at high data rates. However, on-board optical technology has to be cost-effective to be commercially deployed. This study presents a chip-to-chip optical interconnect formed on an optoelectronic printed circuit board that uses a simple optical coupling scheme, cost-effective materials and is compatible with well-established manufacturing processes common to the electronics industry. Details of the link architecture, modelling studies of the link's frequency response, characterisation of optical coupling efficiencies and dynamic performance studies of this proof-of-concept chip-to-chip optical interconnect are reported. The fully assembled link exhibits a -3 dBe bandwidth of 9 GHz and -3 dBo tolerances to transverse component misalignments of ±25 and ±37 μm at the input and output waveguide interfaces, respectively. The link has a total insertion loss of 6 dBo and achieves error-free transmission at a 10 Gb/s data rate with a power margin of 11.6 dBo for a bit-error-rate of 10 -12. The proposed architecture demonstrates an integration approach for high-speed board-level chip-to-chip optical links that emphasises component simplicity and manufacturability crucial to the migration of such technology into real-world commercial systems. © 2012 The Institution of Engineering and Technology.

Market-pull and technology-push in manufacturing start-ups in emerging industries

Purpose - As traditional manufacturing, previously vital to the UK economy, is increasingly outsourced to lower-cost locations, policy makers seek leadership in emerging industries by encouraging innovative start-up firms to pursue competitive opportunities. Emerging industries can either be those where a technology exists but the corresponding downstream value chain is unclear, or a new technology may subvert the existing value chain to satisfy existing customer needs. Hence, this area shows evidence of both technology-push and market-pull forces. The purpose of this paper is to focus on market-pull and technology-push orientations in manufacturing ventures, specifically examining how and why this orientation shifts during the firm's formative years. Design/methodology/approach - A multiple case study approach of 25 UK start-ups in emerging industries is used to examine this seldom explored area. The authors offer two models of dynamic business-orientation in start-ups and explain the common reasons for shifts in orientation and why these two orientations do not generally co-exist during early firm development. Findings - Separate evolution paths were found for strategic orientation in manufacturing start-ups and separate reasons for them to shift in their early development. Technology-push start-ups often changed to a market-pull orientation because of new partners, new market information or shift in management priorities. In contrast, many of the start-ups beginning with a market-pull orientation shifted to a technology-push orientation because early market experiences necessitated a focus on improving processes in order to increase productivity or meet partner specifications, or meet a demand for complementary products. Originality/value - While a significant body of work exists regarding manufacturing strategy in established firms, little work has been found that investigates how manufacturing strategy emerges in start-up companies, particularly those in emerging industries. © Emerald Group Publishing Limited.

Low-cost PCB-integrated 10-Gb/s optical transceiver built with a novel integration method

A novel integration method for the production of cost-effective optoelectronic printed circuit boards (OE PCBs) is presented. The proposed integration method allows fabrication of OE PCBs with manufacturing processes common to the electronics industry while enabling direct attachment of electronic components onto the board with solder reflow processes as well as board assembly with automated pick-and-place tools. The OE PCB design is based on the use of polymer multimode waveguides, end-fired optical coupling schemes, and simple electro-optic connectors, eliminating the need for additional optical components in the optical layer, such as micro-mirrors and micro-lenses. A proof-of-concept low-cost optical transceiver produced with the proposed integration method is presented. This transceiver is fabricated on a low-cost FR4 substrate, comprises a polymer Y-splitter together with the electronic circuitry of the transmitter and receiver modules and achieves error-free 10-Gb/s bidirectional data transmission. Theoretical studies on the optical coupling efficiencies and alignment tolerances achieved with the employed end-fired coupling schemes are presented while experimental results on the optical transmission characteristics, frequency response, and data transmission performance of the integrated optical links are reported. The demonstrated optoelectronic unit can be used as a front-end optical network unit in short-reach datacommunication links. © 2011-2012 IEEE.

Development of a hybrid ferrofluid seal technology for miniature pneumatic and hydraulic actuators

Future microrobotic applications require actuators that can generate a high actuation force and stroke in a limited volume. Up to now, little research has been performed on the development of pneumatic and hydraulic microactuators, although they offer great prospects in achieving high force densities. One of the main technological barriers in the development of these actuators is the fabrication of powerful seals with low leakage. This paper presents a seal technology for linear fluidic microactuators based on ferrofluids. A design and simulation method for these seals has been developed and validated by measurements on miniaturized actuator prototypes. These actuators have an outside diameter of 2 mm, a length of 13 mm and have been tested using both pressurized air and water. Our current actuator prototypes are able to operate at pressures up to 1.6 MPa without leakage. At these pressures, forces up to 0.65 N have been achieved. The stroke of the actuators is 10 mm. © 2009 Elsevier B.V. All rights reserved.

A ferrofluid seal technology for fluidic microactuators

Recent research revealed that microacruators driven by pressurized fluids are able to generate high power and force densities at microscale. Despite these promising properties, fluidic actuators are rare in microsystem technology. The main technological barrier in the development of these actuators is the fabrication of powerful seals with low leakage. This paper presents a seal technology for linear fluidic microacruators based on ferrofluids. An accurate design method for these seals has been developed and validated by measurements on miniaturized actuator prototypes. Our current actuator prototypes are able to seal pressures up to 16 bar without leakage. The actuator has an outside diameter of 2 mm, a length of 13 mm and the actuator is able to generate forces of 0.65 N and a stroke of 10 mm. Moreover, promising properties such as the restoration of the seal after a pressure overload have been observed.