Atom probe tomography for advanced metallization

In microelectronics, the increase in complexity and the reduction of devices dimensions make essential the development of new characterization tools and methodologies. Indeed advanced characterization methods with very high spatial resolution are needed to analyze the redistribution at the nanoscale in devices and interconnections. The atom probe tomography has become an essential analysis to study materials at the nanometer scale. This instrument is the only analytical microscope capable to produce 3D maps of the distribution of the chemical species with an atomic resolution inside a material. This technique has benefit from several instrumental improvements during last years. In particular, the use of laser for the analysis of semiconductors and insulating materials offers new perspectives for characterization. The capability of APT to map out elements at the atomic scale with high sensitivity in devices meets the characterization requirements of semiconductor devices such as the determination of elemental distributions for each device region. In this paper, several examples will show how APT can be used to characterize and understand materials and process for advanced metallization. The possibilities and performances of APT (chemical analysis of all the elements, atomic resolution, planes determination, crystallographic information...) will be described as well as some of its limitations (sample preparation, complex evaporation, detection limit, ...). The examples illustrate different aspect of metallization: dopant profiling and clustering, metallic impurities segregation on dislocation, silicide formation and alloying, high K/metal gate optimization, SiGe quantum dots, as well as analysis of transistors and nanowires. © 2013 Elsevier B.V. All rights reserved.

Design and control of a climbing robot based on hot melt adhesion

Robust climbing in unstructured environments has been one of the long-standing challenges in robotics research. Among others, the control of large adhesion forces is still an important problem that significantly restricts the locomotion performance of climbing robots. The main contribution of this paper is to propose a novel approach to autonomous robot climbing which makes use of hot melt adhesion (HMA). The HMA material is known as an economical solution to achieve large adhesion forces, which can be varied by controlling the material temperature. For locomotion on both inclined and vertical walls, this paper investigates the basic characteristics of HMA material, and proposes a design and control of a climbing robot that uses the HMA material for attaching and detaching its body to the environment. The robot is equipped with servomotors and thermal control units to actively vary the temperature of the material, and the coordination of these components enables the robot to walk against the gravitational forces even with a relatively large body weight. A real-world platform is used to demonstrate locomotion on a vertical wall, and the experimental result shows the feasibility and overall performances of this approach. © 2013 Elsevier B.V. All rights reserved.

Design considerations for attachment and detachment in robot climbing with hot melt adhesives

Robust climbing in unstructured environments is a long-standing challenge in robotics research. Recently there has been an increasing interest in using adhesive materials for that purpose. For example, a climbing robot using hot melt adhesives (HMAs) has demonstrated advantages in high attachment strength, reasonable operation costs, and applicability to different surfaces. Despite the advantages, there still remain several problems related to the attachment and detachment operations, which prevent this approach from being used in a broader range of applications. Among others, one of the main problems lies in the fact that the adhesive characteristics of this material were not fully understood fin the context of robotic climbing locomotion. As a result, the previous robot often could not achieve expected locomotion performances and "contaminated" the environment with HMAs left behind. In order to improve the locomotion performances, this paper focuses on attachment and detachment operations in robot climbing with HMAs. By systematically analyzing the adhesive property and bonding strength of HMAs to different materials, we propose a novel detachment mechanism that substantially improves climbing performances without HMA traces. © 2012 IEEE.

Robotic body extension based on hot melt adhesives

The capability of extending body structures is one of the most significant challenges in the robotics research and it has been partially explored in self-reconfigurable robotics. By using such a capability, a robot is able to adaptively change its structure from, for example, a wheel like body shape to a legged one to deal with complexity in the environment. Despite their expectations, the existing mechanisms for extending body structures are still highly complex and the flexibility in self-reconfiguration is still very limited. In order to account for the problems, this paper investigates a novel approach to robotic body extension by employing an unconventional material called Hot Melt Adhesives (HMAs). Because of its thermo-plastic and thermo-adhesive characteristics, this material can be used for additive fabrication based on a simple robotic manipulator while the established structures can be integrated into the robot's own body to accomplish a task which could not have been achieved otherwise. This paper first investigates the HMA material properties and its handling techniques, then evaluates performances of the proposed robotic body extension approach through a case study of a "water scooping" task. © 2012 IEEE.