Demonstration of a compact InGaAsP active crosspoint switch operating at 1.5 μm using novel reflective y-coupler components

An extremely compact active optoelectronic crosspoint switch, having overall dimensions of 400 μm×200 μm, is reported. The device provides unity facet-to-facet gain for both bar and cross state operation for TE or TM input signals.

Identification of support conditions of buried pipes using a vibrating pig

This paper describes a method for monitoring the variation in support condition of pipelines using a vibration technique. The method is useful for detecting poor support of buried pipelines and for detecting spanning and depth of cover in sub-sea lines. Variation in the pipe support condition leads to increased likelihood of pipe damage. Under roadways, poorly supported pipe may be damaged by vehicle loading. At sea, spanned sections of pipe are vulnerable to ocean current loading and also to snagging by stray anchors in shallow waters. A vibrating `pig' has been developed and tested on buried pipelines. Certain features of pipe support, such as voids and hard spots, display characteristic responses to vibration, and these are measured by the vibrating pig. Post-processing of the measured vibration data is used to produce a graphical representation of the pipeline support and certain `feature characteristics' are identified. In field tests on a pipeline with deliberately constructed support faults, features detected by the vibrating pig are in good agreement with the known construction.

Modelling of waterfront cantilever sheet pile walls subjected to earthquake loading

The seismic performance of waterfront cantilever sheet pile retaining walls is of continuing interest to geotechnical engineers as these structures suffer severe damage and even complete failure during earthquakes. This is often precipitated by liquefaction of the surrounding soil, either in the backfill or in front of the wall. This paper presents results from a series of small-scale plane strain models that were tested on a 1-g shaking table and recorded using a high-speed, high-resolution digital camera. The technique of Particle Image Velocimetry (PIV) was applied in order to allow the failure mechanisms to be visualised. It is shown that using PIV analyses it is possible to obtain failure mechanisms for a cantilever wall in liquefiable soil. These failure mechanisms are compared with those obtained for a cantilever wall in dry soil, previously carried out at a similar scale. It was observed that seismic liquefaction causes significant displacement in much larger zones of soil near the retaining wall compared to an equivalent dry case. The failure mechanism for a cantilever wall with liquefiable backfill, but with a remediated zone designed not to liquefy, is also presented and compared to the unremediated case.

A closely integrated digital image capture device for embedded applications

A modular image capture system with close integration to CCD cameras has been developed. The aim is to produce a system capable of integrating CCD sensor, image capture and image processing into a single compact unit. This close integration provides a direct mapping between CCD pixels and digital image pixels. The system has been interfaced to a digital signal processor board for the development and control of image processing tasks. These have included characterization and enhancement of noisy images from an intensified camera and measurement to subpixel resolutions. A highly compact form of the image capture system is in an advanced stage of development. This consists of a single FPGA device and a single VRAM providing a two chip image capturing system capable of being integrated into a CCD camera. A miniature compact PC has been developed using a novel modular interconnection technique, providing a processing unit in a three dimensional format highly suited to integration into a CCD camera unit. Work is under way to interface the compact capture system to the PC using this interconnection technique, combining CCD sensor, image capture and image processing into a single compact unit. ©2005 Copyright SPIE - The International Society for Optical Engineering.