Separating viscoelasticity and poroelasticity of gels with different length and time scales

Viscoelasticity and poroelasticity commonly coexist as time-dependent behaviors in polymer gels. Engineering applications often require knowledge of both behaviors separated; however, few methods exist to decouple viscoelastic and poroelastic properties of gels. We propose a method capable of separating viscoelasticity and poroelasticity of gels in various mechanical tests. The viscoelastic characteristic time and the poroelastic diffusivity of a gel define an intrinsic material length scale of the gel. The experimental setup gives a sample length scale, over which the solvent migrates in the gel. By setting the sample length to be much larger or smaller than the material length, the viscoelasticity and poroelasticity of the gel will dominate at different time scales in a test. Therefore, the viscoelastic and poroelastic properties of the gel can be probed separately at different time scales of the test. We further validate the method by finite-element models and stress-relaxation experiments. © 2014 The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences and Springer-Verlag Berlin Heidelberg.

Assembly and inspection of liquid crystal on silicon devices

Liquid crystal on silicon (LCOS) is one of the most exciting technologies, combining the optical modulation characteristics of liquid crystals with the power and compactness of a silicon backplane. The objective of our work is to improve cell assembly and inspection methods by introducing new equipment for automated assembly and by using an optical inspection microscope. A Suss-MicroTec Universal device bonder is used for precision assembly and device packaging and an Olympus BX51 high resolution microscope is employed for device inspection. © 2009 Optical Society of America.

Differential equation based length scales to improve DES and RANS simulations

Surprisingly expensive to compute wall distances are still used in a range of key turbulence and peripheral physics models. Potentially economical, accuracy improving differential equation based distance algorithms are considered. These involve elliptic Poisson and hyperbolic natured Eikonal equation approaches. Numerical issues relating to non-orthogonal curvilinear grid solution of the latter are addressed. Eikonal extension to a Hamilton-Jacobi (HJ) equation is discussed. Use of this extension to improve turbulence model accuracy and, along with the Eikonal, enhance Detached Eddy Simulation (DES) techniques is considered. Application of the distance approaches is studied for various geometries. These include a plane channel flow with a wire at the centre, a wing-flap system, a jet with co-flow and a supersonic double-delta configuration. Although less accurate than the Eikonal, Poisson method based flow solutions are extremely close to those using a search procedure. For a moving grid case the Poisson method is found especially efficient. Results show the Eikonal equation can be solved on highly stretched, non-orthogonal, curvilinear grids. A key accuracy aspect is that metrics must be upwinded in the propagating front direction. The HJ equation is found to have qualitative turbulence model improving properties. © 2003 by P. G. Tucker.

Crosstalk reduction in holographic wavelength selective switches based on phase-only LCOS devices

A method to reduce crosstalk is proposed for holographic wavelength selective switches (WSSs) using a customized merit function. A reduction in crosstalk >8 dB is measured when multicasting with a phase-only LCOS device. © OSA 2014.

Ni(Pt)-silicide contacts on CMOS devices: Impact of substrate nature and Pt concentration on the phase formation

Ni silicides used as contacts in source/drain and gate of advanced CMOS devices were analyzed by atom probe tomography (APT) at atomic scale. These measurements were performed on 45 nm nMOS after standard self-aligned silicide (salicide) process using Ni(5 at.% Pt) alloy. After the first annealing (RTA1), δ-Ni2Si was the only phase formed on gate and source/drain while, after the second annealing (RTA2), two different Ni silicides have been formed: NiSi on the gate and δ-Ni2Si on the source and drain. This difference between source/drain and gate regions in nMOS devices has been related to the Si substrate nature (poly or mono-crystalline) and to the size of the contact. In fact, NiSi seems to have difficulties to nucleate in the narrow source/drain contact on mono-crystalline Si. The results have been compared to analysis performed on 28 nm nMOS where the Pt concentration is higher (10 at.% Pt). In this case, θ-Ni2Si is the first phase to form after RTA1 and NiSi is then formed at the same time on source (or drain) and gate after RTA2. The absence of the formation of NiSi from δ-Ni 2Si/Si(1 0 0) interface compared to θ-Ni2Si/Si(1 0 0) interface could be related to the difference of the interface energies. The redistributions of As and Pt in different silicides and interfaces were measured and discussed. In particular, it has been evidenced that Pt redistributions obtained on both 45 and 28 nm MOS transistors correspond to respective Pt distributions measured on blanket wafers. © 2013 Elsevier B.V. All rights reserved.