Soil mix technology for land remediation: Recent innovations

The past 15 years have seen increasing applications of soil mix technology in land remediation, mainly in stabilisation/solidification treatments and the construction of low-permeability cut-off walls and permeable reactive barriers; clear evidence of the versatility of the technology and its wide-ranging applications. This paper provides an overview of some of the recent innovations of soil mix technology in land remediation covering equipment developments and applications, including systems for rectangular panels and trenching systems, treatments, such as chemical oxidation, and additives, such as modified clays, zeolites and reactive magnesia. The paper also provides case studies for such innovations. The paper concludes with an overview of an on-going research and development project SMiRT (Soil Mix Remediation Technology) which will involve field trials on a contaminated site and will employ some of the innovations discussed in the paper. The range of significant advantages that soil mix technology now offers compared to other remediation techniques is likely to place this remediation method at the forefront of remedial options for future brownfield projects.

A process model based methodology to support conflict management

The product design development has increasingly become a collaborative process. Conflicts often appear in the design process due to multi-actors interactions. Therefore, a critical element of collaborative design would be conflict situations resolution. In this paper, a methodology, based on a process model, is proposed to support conflict management. This methodology deals mainly with the conflict resolution team identification and the solution impact evaluation issues. The proposed process model allows the design process traceability and the data dependencies network identification; which making it be possible to identify the conflict resolution actors as well as to evaluate the selected solution impact. Copyright © 2006 IFAC.