39 resultados para Multi microprocessor applications


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Future applications of high temperature superconductors require bulk materials of a complex shape. The multi-seeded-melt-growth process (MSMG) represents a promising technique for obtaining qualitatively well oriented bulk materials with different kinds of shape. In the MSMG process, several seeds are placed on a precursor pellet, from which the growth of the bulk starts. A certain problem of the MSMG process is that grain boundaries become inevitable when the growth fronts of two neighboring seeds collide. These grain boundaries are responsible for a reduction of the critical currents and pose a problem for high current applications. By polishing the sample step by step, the influence of the grain boundaries was investigated by scanning Hall probe measurements and by the magnetoscan technique. Additionally, optical microscopy and electron microscopy were employed to investigate the details of the microstructure. © 2005 IEEE.

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Carbon nanotubes (CNTs) have good mechanical properties and unique structural, electronic, thermal, and optical characteristics. In this work, we present the results of our investigations of a resonator device based on embedded vertical CNT arrays. The device's design is based on the mechanical resonance of the tubes. CoventorWare FEA tools have been used to simulate the mechanical resonance frequencies of the vertical nanotubes arrays integrated on a silicon substrate. ©2008 IEEE.

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We present a new software framework for the implementation of applications that use stencil computations on block-structured grids to solve partial differential equations. A key feature of the framework is the extensive use of automatic source code generation which is used to achieve high performance on a range of leading multi-core processors. Results are presented for a simple model stencil running on Intel and AMD CPUs as well as the NVIDIA GT200 GPU. The generality of the framework is demonstrated through the implementation of a complete application consisting of many different stencil computations, taken from the field of computational fluid dynamics. © 2010 IEEE.