18 resultados para Cu-based alloys
Resumo:
An improved technique for transferring large area graphene grown by chemical vapor deposition on copper is presented. It is based on mechanical separation of the graphene/copper by H2 bubbles during H2O electrolysis, which only takes a few tens of seconds while leaving the copper cathode intact. A semi-rigid plastic frame in combination with thin polymer layer span on graphene gives a convenient way of handling- and avoiding wrinkles and holes in graphene. Optical and electrical characterizations prove the graphene quality is better than that obtained by traditional wet etching transfer. This technique appears to be highly reproducible and cost efficient. © 2013 American Institute of Physics.
Resumo:
The extreme sensitivity of Sm/Ba at high temperature in air becomes an obstacle to the fabrication of SmBCO single grains that exhibit stable and reliable superconducting properties. In this research, the superconducting properties of SmBCO single grains fabricated by top seeded melt growth (TSMG) from different batches of commercial SmBa2Cu3O 7-d (Sm-123) precursor powder using different processing atmospheres (air and 0.1% O2 in Ar), different processing methods (isothermal growth and continuous cooling) and different amounts of BaO2 content to suppress Sm/Ba substitution in air have been investigated in an attempt to understand fully the TSMG process for this system. As a result, based on extensive data, a novel and simple, low temperature post-annealing approach is proposed specifically to overcome the sensitivity of Tc to Sm/Ba substitution in order to simplify the fabrication of SmBCO and to increase its reliability with a view to the practical processing of these materials. Initial processing trials have been performed successfully to demonstrate the viability of the novel post-annealing process. © 2013 IOP Publishing Ltd.
Resumo:
In this work specific film structures of Li-Nb-O/Li/Li-Nb-O are investigated by AC Impedance Spectroscopy measurements at different temperatures. This gives the opportunity to investigate properties of the material itself and, at the same time, to consider the influence of the grain boundaries on the ionic behavior of the polycrystalline Lithium Niobate. On the other hand, LiNbO3/Li/Cu multi-layers are studied as electrolyte/anode bi-layers and potential parts of "Li-free" microbatteries. The Li deficiency in the as deposited Li-Nb-O films is cured by forming a "sandwich" of Li-Nb-O/Li/Li-Nb-O, which after annealing becomes ionic conductor. The electrical behavior of an annealed film depends on two sources. The first is due to properties of the material itself and the second is based on the network of the grain boundaries. The average size of the grains is strongly influenced by the structure of the ohmic-contact/substrate. The electrical behavior of the electrolyte/anode interface of the "Li-free" structure LiNbO3/Li/Cu/Au is very similar to the impedance measurements of the single LiNbO3 single films. The whole multilayer structure, though, presents a third relaxation time which is consistent of a small resistance. This resistance is independent of temperature and it seems that is due to the metallic interface Li/Cu/Au. © 2010 Elsevier B.V. All rights reserved.