Millisecond processing beyond chip technology: From electronics to photonics

There is a clear and increasing interest in short time annealing processing far below one second, i.e. the lower limit of Rapid Thermal Processing (RTP) called spike annealing. This was driven by the need of suppressing the so-called Transient Enhanced Diffusion in advanced boronimplanted shallow pn-junctions in silicon technology. Meanwhile the interest in flash lamp annealing (FLA) in the millisecond range spread out into other fields related to silicon technology and beyond. This paper reports on recent experiments regarding shallow junction engineering in germanium, annealing of ITO layers on glass and plastic foil to form an conductive layer as well as investigations which we did during the last years in the field of wide band gap semiconductor materials (SiC, ZnO). A more common feature evolving from our work was related to the modeling of wafer stress during millisecond thermal processing with flash lamps. Finally recent achievements in the field of silicon-based light emission basing on Metal-Oxide-Semiconductor Light Emitting Devices will be reported. © 2007 IEEE.

Supporting excavations in clay - From analysis to decision-making

Finite Element Analysis (FEA) is used to calibrate a decision-making tool based on an extension of the Mobilized Strength Design (MSD) method which permits the designer an extremely simple method of predicting ground displacements during construction. This newly extended MSD approach accommodates a number of issues which are important in underground construction between in-situ walls, including: alternative base heave mechanisms suitable either for wide excavations in relatively shallow soft clay strata, or narrow excavations in relatively deep soft strata; the influence of support system stiffness in relation to the sequence of propping of the wall; and the capability of dealing with stratified ground. These developments should make it possible for a design engineer to take informed decisions on the relationship between prop spacing and ground movements, or the influence of wall stiffness, or on the need for and influence of a jet-grouted base slab, for example, without having to conduct project-specific FEA. © 2009 Taylor & Francis Group.

Mapping the global flow of steel: from steelmaking to end-use goods.

Our society is addicted to steel. Global demand for steel has risen to 1.4 billion tonnes a year and is set to at least double by 2050, while the steel industry generates nearly a 10th of the world's energy related CO₂ emissions. Meeting our 2050 climate change targets would require a 75% reduction in CO₂ emissions for every tonne of steel produced and finding credible solutions is proving a challenge. The starting point for understanding the environmental impacts of steel production is to accurately map the global steel supply chain and identify the biggest steel flows where actions can be directed to deliver the largest impact. In this paper we present a map of global steel, which for the first time traces steel flows from steelmaking, through casting, forming, and rolling, to the fabrication of final goods. The diagram reveals the relative scale of steel flows and shows where efforts to improve energy and material efficiency should be focused.

A Stochastic Model for Electron Multiplication Charge-Coupled Devices - From Theory to Practice

Electron multiplication charge-coupled devices (EMCCD) are widely used for photon counting experiments and measurements of low intensity light sources, and are extensively employed in biological fluorescence imaging applications. These devices have a complex statistical behaviour that is often not fully considered in the analysis of EMCCD data. Robust and optimal analysis of EMCCD images requires an understanding of their noise properties, in particular to exploit fully the advantages of Bayesian and maximum-likelihood analysis techniques, whose value is increasingly recognised in biological imaging for obtaining robust quantitative measurements from challenging data. To improve our own EMCCD analysis and as an effort to aid that of the wider bioimaging community, we present, explain and discuss a detailed physical model for EMCCD noise properties, giving a likelihood function for image counts in each pixel for a given incident intensity, and we explain how to measure the parameters for this model from various calibration images. © 2013 Hirsch et al.