57 resultados para Condition monitoring


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Advances in the development of computer vision, miniature Micro-Electro-Mechanical Systems (MEMS) and Wireless Sensor Network (WSN) offer intriguing possibilities that can radically alter the paradigms underlying existing methods of condition assessment and monitoring of ageing civil engineering infrastructure. This paper describes some of the outcomes of the European Science Foundation project "Micro-Measurement and Monitoring System for Ageing Underground Infrastructures (Underground M3)". The main aim of the project was to develop a system that uses a tiered approach to monitor the degree and rate of tunnel deterioration. The system comprises of (1) Tier 1: Micro-detection using advances in computer vision and (2) Tier 2: Micro-monitoring and communication using advances in MEMS and WSN. These potentially low-cost technologies will be able to reduce costs associated with end-of-life structures, which is essential to the viability of rehabilitation, repair and reuse. The paper describes the actual deployment and testing of these innovative monitoring tools in tunnels of London Underground, Prague Metro and Barcelona Metro. © 2012 Taylor & Francis Group.

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Abstract-This paper reports a single-crystal silicon mass sensor based on a square-plate resonant structure excited in the wine glass bulk acoustic mode at a resonant frequency of 2.065 MHz and an impressive quality factor of 4 million at 12 mtorr pressure. Mass loading on the resonator results in a linear downshift in the resonant frequency of this device, wherein the measured sensitivity is found to be 175 Hz cm2/μg. The silicon resonator is embedded in an oscillator feedback loop, which has a short-term frequency stability of 3 mHz (approximately 1.5 ppb) at an operating pressure of 3.2 mtorr, corresponding to an equivalent mass noise floor of 17 pg/cm2. Possible applications of this device include thin film monitoring and gas sensing, with the potential added benefits of scalability and integration with CMOS technology. © 2008 IEEE.