Polymer film packaging for food: An environmental assessment

Plastics packaging is ubiquitous in the food industry, fulfilling a range of functions including a significant role in reducing food waste. The public perception of packaging, however, is dominated by end-of-life aspects, when the packaging becomes waste often found littering urban, rural and marine environments. A balanced analysis of the role of packaging demands that the whole lifecycle is examined, looking not only at the packaging itself but also at the product being packaged. This paper focuses on packaging in the meat and cheese industry, analysing the impact of films and bags. The functions of packaging are defined and the environmental impact of delivering these functions is assessed. The influence of packaging on levels of waste and energy consumption elsewhere in the system is examined, including the contentious issue of end-of-life for packaging. Strategies for minimizing the environmental impact of the packaging itself involve reduction in the amount of material used (thinner packaging), rather than emphasizing end-of-life issues. Currently, with polymer recycling not at a high level, evidence suggests that this strategy is justifiable. Biodegradable polymers may have some potential for improving environmental performance, but are still problematic. The conclusion is that although current packaging is in some ways wasteful and inefficient, the alternatives are even less desirable. © 2013 Elsevier B.V. All rights reserved.

High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging

This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/μ), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes. © 2013 IEEE.

Laser micromachining of thin films for optoelectronic devices and packages

Focused laser micromachining in an optical microscope system is used to prototype packages for optoelectronic devices and to investigate new materials with potential applications in packaging. Micromachined thin films are proposed as mechanical components to locate fibres and other optical and electrical components on opto-assemblies. This paper reports prototype structures which are micromachined in silicon carbide to produce beams 5 μm thick by (i) laser cutting a track in a SiC coated Si wafer, (ii) undercutting by anisotropic silicon etching using KOH in water, and (iii) trimming if necessary with the laser system. This approach has the advantage of fast turn around and proof of concept. Mechanical test data are obtained from the prototype SiC beam package structures by testing with a stylus profilometer. The Youngs modulus obtained for chemical vapour deposited silicon carbide is 360 +/- 50 GPa indicating that it is a promising material for packaging applications.

Assembly and inspection of liquid crystal on silicon devices

Liquid crystal on silicon (LCOS) is one of the most exciting technologies, combining the optical modulation characteristics of liquid crystals with the power and compactness of a silicon backplane. The objective of our work is to improve cell assembly and inspection methods by introducing new equipment for automated assembly and by using an optical inspection microscope. A Suss-Micro'Tec Universal device bonder is used for precision assembly and device packaging and an Olympus BX51 high resolution microscope is employed for device inspection. ©2009 Optical Society of America.

Assessing the accessibility of everyday products

If a product is being designed to be genuinely inclusive, then the designers need to be able to assess the level of exclusion of the product that they are working on and to identify possible areas of improvement. To be of practical use, the assessments need to be quick, consistent and repeatable. The aim of this workshop is to invite attendees to participate in the evaluation of a number of everyday objects using an assessment technique being considered by the workshop organisers. The objectives of the workshop include evaluating the effectiveness of the assessment method, evaluating the accessibility of the products being assessed and to suggest revisions to the assessment scales being used. The assessment technique is to be based on the ONS capability measures [1]. This source recognises fourteen capability scales of which seven are particularly pertinent to product evaluation, namely: motion, dexterity, reach and stretch, vision, hearing, communication, and intellectual functioning. Each of these scales ranges from 0 (fully able) through 1 (minimal impairment) to 10 (severe impairment). The attendees will be asked to rate the products on these scales. Clearly the assessed accessibility of the product depends on the assumptions made about the context of use. The attendees will be asked to clearly note the assumptions that they are making about the context in which the product is being assessed. For instance, with a hot water bottle, assumptions have to be made about the availability of hot water and these can affect the overall accessibility rating. The workshop organisers will not specify the context of use as the aim is to identify how assessors would use the assessment method in the real world. The objects being assessed will include items such as remote controls, pill bottles, food packaging, hot water bottles and mobile telephones. the attendees will be encouraged to assess two or more products in detail. Helpers will be on hand to assist and observe the assessments. The assessments will be collated and compared and feedback about the assessment method sought from the attendees. Drawing on a preliminary review of the assessment results, initial conclusions will be presented at the end of the workshop. More detailed analyses will be made available in subsequent proceedings. It is intended that the workshop will provide workshop attendees with an opportunity to perform hands-on assessment of a number everyday products and identify features which are inclusive and those that are not. It is also intended to encourage an appreciation of the capabilities to be considered when evaluating accessibility.

Compact double-side liquid-impingement-cooled integrated power electronic module

This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.

Broadband ultrafast pulse generation with double wall carbon nanotubes

Materials with nonlinear optical properties are much sought after for ultrafast photonic applications. Mode-locked lasers can generate ultrafast pulses using saturable absorbers[1]. Currently, the dominant technology is based on semiconductor saturable absorber mirrors (SESAMs). However, narrow tuning range (tens of nm), complex fabrication and packaging limit their applications[2]. Single wall nanotubes (SWNTs) and graphene offer simpler and cost-effective solutions[1]. Broadband operation can be achieved in SWNTs using a distribution of tube diameters[1,3], or by using graphene[4-8], due to the gapless linear dispersion of Dirac electrons[8,9]. © 2011 IEEE.

Wideband tunable, high-power, graphene mode-locked ultrafast lasers

Ultrafast passively mode-locked lasers with spectral tuning capability and high output power have widespread applications in biomedical research, spectroscopy and telecommunications [1,2]. Currently, the dominant technology is based on semiconductor saturable absorber mirrors (SESAMs) [2,3]. However, these typically have a narrow tuning range, and require complex fabrication and packaging [2,3]. A simple, cost-effective alternative is to use Single Wall Carbon Nanotubes (SWNTs) [4,10] and Graphene [10,14]. Wide-band operation is possible using SWNTs with a wide diameter distribution [5,10]. However, SWNTs not in resonance are not used and may contribute to unwanted insertion losses [10]. The linear dispersion of the Dirac electrons in graphene offers an ideal solution for wideband ultrafast pulse generation [10,15]. © 2011 IEEE.

Building the single market with information technology - lessons from a transnational IT implementation

The subject company operates in a vigorously growing sector of the packaging market, with plants in most European countries. But could this disparate business function as a single company in a single (European) market? This article sets out some lessons learned from a pilot transnational implementation of a strategic management information system, designed to counter entrenched national business thinking in one European company and its subsidiaries.

Superconducting magnetic bearings for energy storage flywheels

We are investigating the use of flywheels for energy storage. Flywheel devices need to be of high efficiency and an important source of losses is the bearings. In addition, the requirement is for the devices to have long lifetimes with minimal or no maintenance. Conventional rolling element bearings can and have been used, but a non-contact bearing, such as a superconducting magnetic bearing, is expected to have a longer lifetime and lower losses. At Cambridge we have constructed a flywheel system. Designed to run in vacuum this incorporates a 40kg flywheel supported on superconducting magnetic bearings. The production device will be a 5kW device storing 5 kWh of retrievable energy at 50,000 rpm. The Cambridge system is being developed in parallel with a similar device supported on a conventional bearing. This will allow direct performance comparisons. Although superconducting bearings are increasingly well understood, of major importance are the cryogenics and special attention is being paid to methods of packaging and insulating the superconductors to cut down radiation losses. The work reported here is part of a three-year program of work supported by the EPSRC. © 1999 IEEE.

Half-bridge SIC inverter for hybrid electric vehicles: Design, development and testing at higher operating temperature

In recent years, Silicon Carbide (SiC) semiconductor devices have shown promise for high density power electronic applications, due to their electrical and thermal properties. In this paper, the performance of SiC JFETs for hybrid electric vehicle (HEV) applications is investigated at heatsink temperatures of 100 °C. The thermal runaway characteristics, maximum current density and packaging temperature limitations of the devices are considered and the efficiency implications discussed. To quantify the power density capabilities of power transistors, a novel 'expression of rating' (EoR) is proposed. A prototype single phase, half-bridge voltage source inverter using SiC JFETs is also tested and its performance at 25 °C and 100 °C investigated.

Towards a fast electro-thermo-mechanical IGBT/Diode simulation framework for design of reliable power electronic converters

This paper describes a methodology that enables fast and reasonably accurate prediction of the reliability of power electronic modules featuring IGBTs and p-i-n diodes, by taking into account thermo-mechanical failure mechanisms of the devices and their associated packaging. In brief, the proposed simulation framework performs two main tasks which are tightly linked together: (i) the generation of the power devices' transient thermal response for realistic long load cycles and (ii) the prediction of the power modules' lifetime based on the obtained temperature profiles. In doing so the first task employs compact, physics-based device models, power losses lookup tables and polynomials and combined material-failure and thermal modelling, while the second task uses advanced reliability tests for failure mode and time-to-failure estimation. The proposed technique is intended to be utilised as a design/optimisation tool for reliable power electronic converters, since it allows easy and fast investigation of the effects that changes in circuit topology or devices' characteristics and packaging have on the reliability of the employed power electronic modules. © 2012 IEEE.