Heat transfer and aerodynamics of turbine blade tips in a linear cascade

Local measurements of the heat transfer coefficient and pressure coefficient were conducted on the tip and near tip region of a generic turbine blade in a five-blade linear cascade. Two tip clearance gaps were used: 1.6% and 2.8% chord. Data was obtained at a Reynolds number of 2.3 × 10 5 based on exit velocity and chord. Three different tip geometries were investigated: a flat (plain) tip, a suction-side squealer, and a cavity squealer. The experiments reveal that the flow through the plain gap is dominated by flow separation at the pressure-side edge and that the highest levels of heat transfer are located where the flow reattaches on the tip surface. High heat transfer is also measured at locations where the tip-leakage vortex has impinged onto the suction surface of the aerofoil. The experiments are supported by flow visualisation computed using the CFX CFD code which has provided insight into the fluid dynamics within the gap. The suction-side and cavity squealers are shown to reduce the heat transfer in the gap but high levels of heat transfer are associated with locations of impingement, identified using the flow visualisation and aerodynamic data. Film cooling is introduced on the plain tip at locations near the pressure-side edge within the separated region and a net heat flux reduction analysis is used to quantify the performance of the successful cooling design. copyright © 2005 by ASME.

Spinning off a semiconductor company from University premises -The story of Camsemi

The spinning off of Cambridge Semiconductor Ltd (Camsemi) from the High Voltage Microelectronics Lab at Cambridge University is discussed. The technology originated from Cambridge University and was subsequently developed and commercialized as PowerBrane by Camsemi. The paper also discusses the business model and the enabling financial factors that led to the formation of Camsemi as a fables IC company, including access to seed funding from University and the subsequent investments of venture capital in several rounds. © 2011 IEEE.

Dynamic compressive response of composite square honeycombs

Carbon fibre-epoxy composite square honeycombs, and the parent composite material, were tested in quasi-static compression at a strain rate of 10 -3 s -1 and in dynamic compression at strain rates of 10 3-10 4 s -1 using an instrumented Kolsky bar arrangement. Taken together, these tests provide an assessment of the potential of this composite topology for use as a lightweight sandwich core. The honeycombs had two relative densities, 0.12 and 0.24, and two material orientations, ±45° and 0/90° with respect to the prismatic, loading direction of the honeycomb. Honeycomb manufacture was by slotting, assembling and bonding together carbon fibre/epoxy woven plies of composite sheets of 2 × 2 twill weave construction. The peak value of wall stress in the honeycombs was about one third that of the parent material, for all strain rates. An elastic finite element analysis was used to trace the source of this knock-down in strength: a stress concentration exists at the root of the slots and leads to premature failure by microbuckling. Shock-wave effects were evident at impact velocities exceeding 50 ms -1 for the honeycomb of relative density 0.12. This was traced to stubbing of the buckled cell walls against the face of the Kolsky bar. © 2011 Elsevier Ltd. All rights reserved.

SOI sensing technologies for harsh environment

This paper reviews and addresses certain aspects of Silicon-On-Insulator (SOI) technologies for a harsh environment. The paper first describes the need for specialized sensors in applications such as (i) domestic and other small-scale boilers, (ii) CO2 Capture and Sequestration, (iii) oil & gas storage and transportation, and (iv) automotive. We describe in brief the advantages and special features of SOI technology for sensing applications requiring temperatures in excess of the typical bulk silicon junction temperatures of 150oC. Finally we present the concepts, structures and prototypes of simple and smart micro-hotplate and Infra Red (IR) based emitters for NDIR (Non Dispersive IR) gas sensors in harsh environments. © 2012 IEEE.