199 resultados para Electronic units


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Optical technologies have received large interest in recent years for use in board-level interconnects. Polymer multimode waveguides in particular, constitute a promising technology for high-capacity optical backplanes as they can be cost-effectively integrated onto conventional printed circuit boards (PCBs). This paper presents the first optical backplane demonstrator based on the use of PCB-integrated polymer multimode waveguides and a regenerative shared bus architecture. The backplane demonstrator is formed with commercially-available low-cost electronic and photonic components onto conventional FR4 substrates and comprises two opto-electronic (OE) bus modules interconnected via a prototype regenerator unit. The system enables interconnection between the connected cards over four optical channels, each operating at 10 Gb/s. Bus extension is achieved by cascading OE bus modules via 3R regenerator units, overcoming therefore the inherent limitation of optical bus topologies in the maximum number of cards that can be connected to the bus. Details of the design, fabrication, and assembly of the different parts of this optical bus backplane are presented and related optical and data transmission characterisation studies are reported. The optical layer of the OE bus modules comprises a four-channel three-card waveguide layout that is compatible with VCSEL/PD arrays and ribbon fibres. All on-board optical paths exhibit insertion losses below 13 dB and intra-channel crosstalk lower than -29 dB. The robustness of the signal distribution from the bus inputs to all respective bus output ports in the presence of input misalignment is demonstrated, while 1 dB input alignment tolerances of approximately ±10 μm are obtained. The electrical layer of the OE bus modules comprises the essential driving circuitry for 1×4 VCSEL and PD arrays and the corresponding control and power regulation circuits. The interface between the optical and electrical layers of the bus modules is achieved with simple OE connectors that enable end-fired optical coupling into and out of the on-board polymer waveguides. The backplane demonstrator achieves error-free (BER < 10-12) 10 Gb/s data transmission over each optical channel, enabling therefore, an aggregate interconnection capacity of 40 Gb/s between any connected cards. © 1983-2012 IEEE.

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A novel launch scheme is proposed for multimode-fiber (MMF) links. Enhanced performance in 10 Gb/s MMF links using electronic equalization is demonstrated by statistical analysis of installed-base fiber and an experimental investigation. © 2007 Optical Society of America.

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The adaptation of robots to changing tasks has been explored in modular self-reconfigurable robot research, where the robot structure is altered by adapting the connectivity of its constituent modules. As these modules are generally complex and large, an upper bound is imposed on the resolution of the built structures. Inspired by growth of plants or animals, robotic body extension (RBE) based on hot melt adhesives allows a robot to additively fabricate and assemble tools, and integrate them into its own body. This enables the robot to achieve tasks which it could not achieve otherwise. The RBE tools are constructed from hot melt adhesives and therefore generally small and only passive. In this paper, we seek to show physical extension of a robotic system in the order of magnitude of the robot, with actuation of integrated body parts, while maintaining the ability of RBE to construct parts with high resolution. Therefore, we present an enhancement of RBE based on hot melt adhesives with modular units, combining the flexibility of RBE with the advantages of simple modular units. We explain the concept of this new approach and demonstrate with two simple unit types, one fully passive and the other containing a single motor, how the physical range of a robot arm can be extended and additional actuation can be added to the robot body. © 2012 IEEE.