171 resultados para Dye transfer


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We have prepared single crystalline SnO2 and ZnO nanowires and polycrystalline TiO2 nanotubes (1D networks) as well as nanoparticle-based films (3D networks) from the same materials to be used as photoanodes for solid-state dye-sensitized solar cells. In general, superior photovoltaic performance can be achieved from devices based on 3-dimensional networks, mostly due to their higher short circuit currents. To further characterize the fabricated devices, the electronic properties of the different networks were measured via the transient photocurrent and photovoltage decay techniques. Nanowire-based devices exhibit extremely high, light independent electron transport rates while recombination dynamics remain unchanged. This indicates, contrary to expectations, a decoupling of transport and recombination dynamics. For typical nanoparticle-based photoanodes, the devices are usually considered electron-limited due to the poor electron transport through nanocrystalline titania networks. In the case of the nanowire-based devices, the system becomes limited by the organic hole transporter used. In the case of polycrystalline TiO2 nanotube-based devices, we observe lower transport rates and higher recombination dynamics than their nanoparticle-based counterparts, suggesting that in order to improve the electron transport properties of solid-state dye-sensitized solar cells, single crystalline structures should be used. These findings should aid future design of photoanodes based on nanowires or porous semiconductors with extended crystallinity to be used in dye-sensitized solar cells. © 2013 The Royal Society of Chemistry.

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Aging concrete infrastructure in developed economies and more recently constructed concrete infrastructure in the developing world are frequently found to be deficient in structural strength relative to current needs. This can be attributed to a variety of factors including deterioration, construction defects, accidental damage, changes in understanding and failure to design for future loading requirements. Strengthening existing concrete structures can be a cost and carbon effective alternative to replacement. A competitive option for the strengthening of concrete slab-on-beam structures that are deficient in shear capacity is the U-wrapping of the down-stand beam portion of the shear span with externally bonded FRP fabric. While guidance exists for the strengthening of reinforced concrete by U-wrapping, the interaction between internal steel reinforcement, concrete and external FRP in the presence of a dominant diagonal shear crack is not well understood. An approach adopted in previous work has been to explore this interaction through conventional push-off testing. In conventional push-off testing, unlike in a beam, the shear plane is parallel to the direction of loading and perpendicular to the principal fibre orientation. This paper presents a novel push-off test variation in which the shear plane is inclined at 45° to the direction of loading and the principal fibre orientation. A variety of reinforcement ratios, FRP thicknesses and FRP end conditions are modelled. The implications of inclined cracking on debonding of FRP are investigated. The suitability and relevance of inclined push-off tests for further work in this area is also assessed. © 2013, NetComposite Limited.

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The transfer printing of 2 μm-thick aluminum indium gallium nitride (AlInGaN) micron-size light-emitting diodes with 150 nm (±14 nm) minimum spacing is reported. The thin AlInGaN structures were assembled onto mechanically flexible polyethyleneterephthalate/polydimethylsiloxane substrates in a representative 16 × 16 array format using a modified dip-pen nano-patterning system. Devices in the array were positioned using a pre-calculated set of coordinates to demonstrate an automated transfer printing process. Individual printed array elements showed blue emission centered at 486 nm with a forward-directed optical output power up to 80 μW (355 mW/cm 2) when operated at a current density of 20 A/cm2. © 2013 AIP Publishing LLC.

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We report the fabrication of a mechanically-flexible 16×16 array of thin-film, micron-size LEDs emitting at 480 nm. Devices were transfer-printed onto a mechanically-flexible ITO backplane using a modified, high-precision (placement accuracy ±25 nm) assembly system. © 2013 IEEE.