High temperature direct double side cooled inverter module for hybrid electric vehicle application

In this paper a novel approach to the design and fabrication of a high temperature inverter module for hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of the conventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over 200°C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, a SiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, double-sided cooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. The tiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wire bonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Both sides of the assembly are cooled directly using a high-performance liquid impingement system. Specific features of the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cycling life. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gate drives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3.

Compact double-side liquid-impingement-cooled integrated power electronic module

This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.

Security considerations in the design and peering of RFID discovery services

There is growing interest in Discovery Services for locating RFID and supply chain data between companies globally, to obtain product lifecycle information for individual objects. Discovery Services are heralded as a means to find serial-level data from previously unknown parties, however more realistically they provide a means to reduce the communications load on the information services, the network and the requesting client application. Attempts to design a standardised Discovery Service will not succeed unless security is considered in every aspect of the design. In this paper we clearly show that security cannot be bolted-on in the form of access control, although this is also required. The basic communication model of the Discovery Service critically affects who shares what data with whom, and what level of trust is required between the interacting parties. © 2009 IEEE.

4-Channel polymeric optical bus module for board-level optical interconnections

A 4-channel polymeric optical bus module suitable for use in board-level interconnections is presented. Low-loss and low-crosstalk module performance is achieved, while -1 dB alignment tolerances better than ± 8 μm are demonstrated. © 2012 OSA.

Enforcing RFID data visibility restrictions using XACML security policies

Radio Frequency Identification (RFID) technology allows automatic data capture from tagged objects moving in a supply chain. This data can be very useful if it is used to answer traceability queries, however it is distributed across many different repositories, owned by different companies. © 2012 IEEE.