3 resultados para Shaping
em Universidad Politécnica de Madrid
Resumo:
A method of unpolarized laser pulses shaping is reported. The basis of the method is the use of an hybrid optical bistable device with nematic liquid-crystals, similar to the one previously reported by us. A sample of the input light constrols, by an asymmetrical electronic comparator, a 1 x 2 electro-optical total switch. The output pulses are reshaped and maintain the same polarization properties as the input light. From triangular input light signals, symmetriacl and asymmetrical output pulses have been obtained. The minimum pulse width achieved was 0.1 msec. A representation of the output versus input light signals gives an hysteresys cycle in the asymmetrical case.
Resumo:
In this paper we report a new method of laser pulse shaping by the use of liquid crystals as non linear materials. The basis of this method is similar to the one reported by us for an hybrid optical bistable device, but with a different electronic circuitry and feedback.
Resumo:
Continuous and long-pulse lasers have been extensively used for the forming of metal sheets for macroscopic mechanical applications. However, for the manufacturing of Micro-Mechanical Systems (MMS), the applicability of such type of lasers is limited by the long relaxation time of the thermal fields responsible for the forming phenomena. As a consequence, the final sheet deformation state is attained only after a certain time, what makes the generated internal residual stress fields more dependent on ambient conditions and might difficult the subsequent assembly process. The use of short pulse (ns) lasers provides a suitable parameter matching for the laser forming of an important range of sheet components used in MEMS. The short interaction time scale required for the predominantly mechanic (shock) induction of deformation residual stresses allows the successful processing of components in a medium range of miniaturization (particularly important according to its frequent use in such systems). In the present paper, Laser Shock Micro-Forming (LSμF) is presented as an emerging technique for Microsystems parts shaping and adjustment along with a discussion on its physical foundations and practical implementation possibilities developed by the authors.