Statistical mechanics approaches to granular media: between micromechanics and macromechanics

The mechanical behavior of granular materials has been traditionally approached through two theoretical and computational frameworks: macromechanics and micromechanics. Macromechanics focuses on continuum based models. In consequence it is assumed that the matter in the granular material is homogeneous and continuously distributed over its volume so that the smallest element cut from the body possesses the same physical properties as the body. In particular, it has some equivalent mechanical properties, represented by complex and non-linear constitutive relationships. Engineering problems are usually solved using computational methods such as FEM or FDM. On the other hand, micromechanics is the analysis of heterogeneous materials on the level of their individual constituents. In granular materials, if the properties of particles are known, a micromechanical approach can lead to a predictive response of the whole heterogeneous material. Two classes of numerical techniques can be differentiated: computational micromechanics, which consists on applying continuum mechanics on each of the phases of a representative volume element and then solving numerically the equations, and atomistic methods (DEM), which consist on applying rigid body dynamics together with interaction potentials to the particles. Statistical mechanics approaches arise between micro and macromechanics. It tries to state which the expected macroscopic properties of a granular system are, by starting from a micromechanical analysis of the features of the particles and the interactions. The main objective of this paper is to introduce this approach.

Mechanical behavior of 2G REBCO HTS at 77 and 300 K

El gran esfuerzo realizado durante la última década con el fin de integrar los diferentes materiales superconductores en el campo de los sistemas eléctricos y en otras aplicaciones tecnológicas ha dado lugar a un campo de investigación amplio y prometedor. El comportamiento eléctrico de los Superconductores de Alta Temperatura (SAT) crítica (masivo y cintas) depende de diferentes parámetros desde su fabricación hasta la aplicación final con imanes o cables. Sin embargo, las aplicaciones prácticas de estos materiales están fuertemente vinculadas con su comportamiento mecánico tanto a temperatura ambiente (manipulación durante fabricación o instalación) como a temperaturas criogénicas (condiciones de servicio). En esta tesis se ha estudiado el comportamiento mecánico de materiales masivos y cintas de alta temperatura crítica a 300 y 77 K (utilizando nitrógeno líquido). Se han obtenido la resistencia en flexión, la tenacidad de fractura y la resistencia a tracción a la temperatura de servicio y a 300 K. Adicionalmente, se ha medido la dureza mediante el ensayo Vickers y nanoindentación. El módulo Young se midió mediante tres métodos diferentes: 1) nanoindentación, 2) ensayos de flexión en tres puntos y 3) resonancia vibracional mediante grindosonic. Para cada condición de ensayo, se han analizado detalladamente las superficies de fractura y los micromecanismos de fallo. Las propiedades mecánicas de los materiales se han comparado con el fin de entender la influencia de las técnicas de procesado y de las características microestructurales de los monocristales en su comportamiento mecánico. Se ha estudiado el comportamiento electromecánico de cintas comerciales superconductoras de YBCO mediante ensayos de tracción y fatiga a 77 y 300 K. El campo completo de deformaciones en la superficie del material se ha obtenido utilizando Correlación Digital de Imágenes (DIC, por sus siglas en inglés) a 300 K. Además, se realizaron ensayos de fragmentación in situ dentro de un microscopio electrónico con el fin de estudiar la fractura de la capa superconductora y determinar la resistencia a cortante de la intercara entre el substrato y la capa cerámica. Se ha conseguido ver el proceso de la fragmentación aplicando tensión axial y finalmente, se han implementado simulaciones mediante elementos finitos para reproducir la delaminación y el fenómeno de la fragmentación. Por último, se han preparado uniones soldadas entre las capas de cobre de dos cintas superconductoras. Se ha medido la resistencia eléctrica de las uniones con el fin de evaluar el metal de soldadura y el proceso. Asimismo, se ha llevado a cabo la caracterización mecánica de las uniones mediante ensayos "single lap shear" a 300 y 77 K. El efecto del campo magnético se ha estudiado aplicando campo externo hasta 1 T perpendicular o paralelo a la cinta-unión a la temperatura de servicio (77 K). Finalmente, la distribución de tensiones en cada una de las capas de la cinta se estudió mediante simulaciones de elementos finitos, teniendo en cuenta las capas de la cinta mecánicamente más representativas (Cu-Hastelloy-Cu) que influyen en su comportamiento mecánico. The strong effort that has been made in the last years to integrate the different superconducting materials in the field of electrical power systems and other technological applications led to a wide and promising research field. The electrical behavior of High Temperature Superconducting (HTS) materials (bulk and coated conductors) depends on different parameters since their processing until their final application as magnets or cables. However, practical applications of such materials are strongly related with their mechanical performance at room temperature (handling) as well as at cryogenic temperatures (service conditions). In this thesis, the mechanical behavior of HTS bulk and coated conductors was investigated at 300 and 77 K (by immersion in liquid nitrogen). The flexural strength, the fracture toughness and the tensile strength were obtained at service temperature as well as at 300 K. Furthermore, their hardness was determined by Vickers measurements and nanoindentation and the Young's modulus was measured by three different techniques: 1) nanoindentation, 2) three-point bending tests and 3) vibrational resonance with a grindosonic device. The fracture and deformation micromechanics have been also carefully analyzed for each testing condition. The comparison between the studied materials has been performed in order to understand the influence of the main sintering methods and the microstructural characteristics of the single grains on the macroscopic mechanical behavior. The electromechanical behavior of commercial YBCO coated conductors was studied. The mechanical behavior of the tapes was studied under tensile and fatigue tests at 77 and 300 K. The complete strain field on the surface of the sample was obtained by applying Digital Image Correlation (DIC) at 300 K. Addionally, in situ fragmentation tests inside a Scanning Electron Microscope (SEM) were carried out in order to study the fragmentation of the superconducting layer and determine the interfacial shear strength between substrate and ceramic layer. The fragmentation process upon loading of the YBCO layer has been observed and finally, Finite Element Simulations were employed to reproduce delamination and fragmentation phenomena. Finally, joints between the stabilizing Cu sides of two coated conductors have been prepared. The electrical resistivity of the joints was measured for the purpose of qualifying the soldering material and evaluating the soldering process. Additionally, mechanical characterization under single lap shear tests at 300 and 77 K has been carried out. The effect of the applied magnetic field has been studied by applying external magnetic field up to 1 T perpendicular and parallel to the tape-joint at service temperature (77 K). Finally, finite element simulations were employed to study the distribution of the stresses in earch layer, taking into account the three mechanically relevant layers of the coated conductor (Cu-Hastelloy-Cu) that affect its mechanical behavior

A numerical study of the influence of microvoids in the transverse mechanical response of unidirectional composites

The effect of porosity on the transverse mechanical properties of unidirectional fiber-reinforced composites is studied by means of computational micromechanics. The composite behavior is simulated by the finite element analysis of a representative volume element of the composite microstructure in which the random distribution of fibers and the voids are explicitly included. Two types of voids – interfiber voids and matrix voids – were included in the microstructure and the actual damage mechanisms in the composite, namely matrix and interface failure, were accounted for. It was found that porosity (in the range 1–5%) led to a large reduction in the transverse strength and the influence of both types of voids in the onset and propagation of damage throughout the microstructure was studied under transverse tension and compression. Finally, the failure locus of the composite lamina under transverse tension/compression and out-of-plane shear was obtained by means of computational micromechanics and compared with the predictions of Puck’s model and with experimental data available in the literature. The results show that the strength of composites is significantly reduced by the presence of voids

A mechanical characterization of soft tissues based on their mesostructure

Se presenta una relación entre las propiedades mecánicas de los tejidos fibrados y las características geométricas y mecánicas de los fibriles que lo forman a escala mesoscópica. In this work we derive a relationship between the mechanical and geometrical properties of the fibril constituents and the soft tissue material parameters at macroscopic scale.

Post-CMOS compatible high-throughput fabrication of AIN-based piezoelectric microcantilevers

A post-complementary metal oxide semiconductor (CMOS) compatible microfabrication process of piezoelectric cantilevers has been developed. The fabrication process is suitable for standard silicon technology and provides low-cost and high-throughput manufacturing. This work reports design, fabrication and characterization of piezoelectric cantilevers based on aluminum nitride (AlN) thin films synthesized at room temperature. The proposed microcantilever system is a sandwich structure composed of chromium (Cr) electrodes and a sputtered AlN film. The key issue for cantilever fabrication is the growth at room temperature of the AlN layer by reactive sputtering, making possible the innovative compatibility of piezoelectric MEMS devices with CMOS circuits already processed. AlN and Cr have been etched by inductively coupled plasma (ICP) dry etching using a BCl3–Cl2–Ar plasma chemistry. As part of the novelty of the post-CMOS micromachining process presented here, a silicon Si (1 0 0) wafer has been used as substrate as well as the sacrificial layer used to release the microcantilevers. In order to achieve this, the Si surface underneath the structure has been wet etched using an HNA (hydrofluoric acid + nitric acid + acetic acid) based solution. X-ray diffraction (XRD) characterization indicated the high crystalline quality of the AlN film. An atomic force microscope (AFM) has been used to determine the Cr electrode surface roughness. The morphology of the fabricated devices has been studied by scanning electron microscope (SEM). The cantilevers have been piezoelectrically actuated and their out-of-plane vibration modes were detected by vibrometry.