Strategic directions in constraint programming

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Hiord: A type-free higher-order logic programming language with predicate abstraction

A new formalism, called Hiord, for defining type-free higherorder logic programming languages with predicate abstraction is introduced. A model theory, based on partial combinatory algebras, is presented, with respect to which the formalism is shown sound. A programming language built on a subset of Hiord, and its implementation are discussed. A new proposal for defining modules in this framework is considered, along with several examples.

Languages for safety-certification related propertis

The Safety Certification of Software-Intensive Systems with Reusable Components project, in short SafeCer (www.safecer.eu),is targeting increased efficiency and reduced time-to-market by composable safety certification of safety- relevant embedded systems. The industrial domains targeted are within automotive and construction equipment, avionics, and rail. Some of the companies involved are: Volvo Tech- nology, Thales, TTTech, and Intecs among others. SafeCer includes more than 30 partners in six different countries and has a budget of e25.7 millions. A primary objective is to provide support for system safety arguments based on arguments and properties of system components as well as to provide support for generation of corresponding evidence in a similar compositional way. By providing support for efficient reuse of certification and stronger links between certification and development, compo- nent reuse will be facilitated, and by providing support for reuse across domains the amount of components available for reuse will increase dramatically. The resulting efficiency and reduced time to market will, together with increased quality and reduced risk, increase competitiveness and pave the way for a cross-domain market for software components qualified for certification.

How do various maize crop models vary in their responses to climate change factors?

Comments This article is a U.S. government work, and is not subject to copyright in the United States. Abstract Potential consequences of climate change on crop production can be studied using mechanistic crop simulation models. While a broad variety of maize simulation models exist, it is not known whether different models diverge on grain yield responses to changes in climatic factors, or whether they agree in their general trends related to phenology, growth, and yield. With the goal of analyzing the sensitivity of simulated yields to changes in temperature and atmospheric carbon dioxide concentrations [CO2], we present the largest maize crop model intercomparison to date, including 23 different models. These models were evaluated for four locations representing a wide range of maize production conditions in the world: Lusignan (France), Ames (USA), Rio Verde (Brazil) and Morogoro (Tanzania). While individual models differed considerably in absolute yield simulation at the four sites, an ensemble of a minimum number of models was able to simulate absolute yields accurately at the four sites even with low data for calibration, thus suggesting that using an ensemble of models has merit. Temperature increase had strong negative influence on modeled yield response of roughly 0.5 Mg ha 1 per °C. Doubling [CO2] from 360 to 720 lmol mol 1 increased grain yield by 7.5% on average across models and the sites. That would therefore make temperature the main factor altering maize yields at the end of this century. Furthermore, there was a large uncertainty in the yield response to [CO2] among models. Model responses to temperature and [CO2] did not differ whether models were simulated with low calibration information or, simulated with high level of calibration information.

Influence of fabrication steps on optical and electrical properties of InN thin films

This paper reports on a case study of the impact of fabrication steps on InN material properties. We discuss the influence of annealing time and sequence of device processing steps. Photoluminescence (PL), surface morphology and electrical transport (electrical resistivity and low frequency noise) properties have been studied as responses to the adopted fabrication steps. Surface morphology has a strong correlation with annealing times, while sequences of fabrication steps do not appear to be influential. In contrast, the optical and electrical properties demonstrate correlation with both etching and thermal annealing. For all the studied samples PL peaks were in the vicinity of 0.7 eV, but the intensity and full width at half maximum (FWHM) demonstrate a dependence on the technological steps followed. Sheet resistance and electrical resistivity seem to be lower in the case of high defect introduction due to both etching and thermal treatments. The same effect is revealed through 1/f noise level measurements. A reduction of electrical resistivity is connected to an increase in 1/f noise level.