Study of the brittle fracture of monocrystalline silicon wafers

There is a growing trend towards using thinner wafers in order to reduce the costs of solar energy. But the current tools employed during the solar cells production are not prepared to work with thinner wafers, decreasing the industrial yield due to the high number of wafers broken. To develop new tools, or modify existing ones, the mechanical properties have to be determined. This paper tackles an experimental study of the mechanical properties of wafers. First, the material characteristics are detailed and the process to obtain wafers is presented. Then, the complete test setup and the mechanical strength results interpreted by a described numerical model are shown.

An embedded cohesive crack model for finite element analysis of quasi-brittle materials

This paper presents a numerical implementation of the cohesive crack model for the anal-ysis of quasibrittle materials based on the strong discontinuity approach in the framework of the finite element method. A simple central force model is used for the stress versus crack opening curve. The additional degrees of freedom defining the crack opening are determined at the crack level, thus avoiding the need for performing a static condensation at the element level. The need for a tracking algorithm is avoided by using a consistent pro-cedure for the selection of the separated nodes. Such a model is then implemented into a commercial program by means of a user subroutine, consequently being contrasted with the experimental results. The model takes into account the anisotropy of the material. Numerical simulations of well-known experiments are presented to show the ability of the proposed model to simulate the fracture of quasibrittle materials such as mortar, concrete and masonry.