1968-1969 Progress Report

This report mainly summarizes the Project MAC A.I. Group work between July 1968 and June 1969 but covers some work up to February 1970. The work on computer vision is described in detail. This summary should be read in conjunction with last year's A.I. Group Report which is included at the end of this Memo.

New Progress in Artificial Intelligence

This report concentrates on progress during the last two years at the M.I.T. Artificial Intelligence Laboratory. Topics covered include the representation of knowledge, understanding English, learning and debugging, understanding vision and productivity technology. It is stressed that these various areas are tied closely together through certain fundamental issues and problems.

Progress in Vision and Robotics

The Vision Flashes are informal working papers intended primarily to stimulate internal interaction among participants in the A.I. Laboratory's Vision and Robotics group. Many of them report highly tentative conclusions or incomplete work. Others deal with highly detailed accounts of local equipment and programs that lack general interest. Still others are of great importance, but lack the polish and elaborate attention to proper referencing that characterizes the more formal literature. Nevertheless, the Vision Flashes collectively represent the only documentation of an important fraction of the work done in machine vision and robotics. The purpose of this report is to make the findings more readily available, but since they are not revised as presented here, readers should keep in mind the original purpose of the papers!

Investigation of aspect ratio of hole drilling from micro to nanoscale via focused ion beam fine milling

Holes with different sizes from microscale to nanoscale were directly fabricated by focused ion beam (FIB) milling in this paper. Maximum aspect ratio of the fabricated holes can be 5:1 for the hole with large size with pure FIB milling, 10:1 for gas assistant etching, and 1:1 for the hole with size below 100 nm. A phenomenon of volume swell at the boundary of the hole was observed. The reason maybe due to the dose dependence of the effective sputter yield in low intensity Gaussian beam tail regions and redeposition. Different materials were used to investigate variation of the aspect ratio. The results show that for some special material, such as Ni-Be, the corresponding aspect ratio can reach 13.8:1 with Cl₂ assistant etching, but only 0.09:1 for Si(100) with single scan of the FIB.

Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds

High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8].