A Coupled Multi-ALU Processing Node for a Highly Parallel Computer

This report describes Processor Coupling, a mechanism for controlling multiple ALUs on a single integrated circuit to exploit both instruction-level and inter-thread parallelism. A compiler statically schedules individual threads to discover available intra-thread instruction-level parallelism. The runtime scheduling mechanism interleaves threads, exploiting inter-thread parallelism to maintain high ALU utilization. ALUs are assigned to threads on a cycle byscycle basis, and several threads can be active concurrently. Simulation results show that Processor Coupling performs well both on single threaded and multi-threaded applications. The experiments address the effects of memory latencies, function unit latencies, and communication bandwidth between function units.

A Parallel Crossbar Routing Chip for a Shared Memory Multiprocessor

This thesis describes the design and implementation of an integrated circuit and associated packaging to be used as the building block for the data routing network of a large scale shared memory multiprocessor system. A general purpose multiprocessor depends on high-bandwidth, low-latency communications between computing elements. This thesis describes the design and construction of RN1, a novel self-routing, enhanced crossbar switch as a CMOS VLSI chip. This chip provides the basic building block for a scalable pipelined routing network with byte-wide data channels. A series of RN1 chips can be cascaded with no additional internal network components to form a multistage fault-tolerant routing switch. The chip is designed to operate at clock frequencies up to 100Mhz using Hewlett-Packard's HP34 $1.2\\mu$ process. This aggressive performance goal demands that special attention be paid to optimization of the logic architecture and circuit design.

Thermal control of electronics: Perspectives and prospects

One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come.