5 resultados para comprehension prediction

em Massachusetts Institute of Technology


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This report investigates the process of focussing as a description and explanation of the comprehension of certain anaphoric expressions in English discourse. The investigation centers on the interpretation of definite anaphora, that is, on the personal pronouns, and noun phrases used with a definite article the, this or that. Focussing is formalized as a process in which a speaker centers attention on a particular aspect of the discourse. An algorithmic description specifies what the speaker can focus on and how the speaker may change the focus of the discourse as the discourse unfolds. The algorithm allows for a simple focussing mechanism to be constructed: and element in focus, an ordered collection of alternate foci, and a stack of old foci. The data structure for the element in focus is a representation which encodes a limted set of associations between it and other elements from teh discourse as well as from general knowledge.

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How does a person answer questions about children's stories? For example, consider 'Janet wanted Jack's paints. She looked at the picture he was painting and said 'Those paints make your picture look funny.' The question to ask is 'Why did Janet say that?'. We propose a model which answers such questions by relating the story to background real world knowledge. The model tries to generate and answer important questions about the story as it goes along. Within this model we examine two questions about the story as it goes along. Within this model we examine two problems, how to organize this real world knowledge, and how it enters into more traditional linguistic questions such as deciding noun phrase reference.

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There has been recent interest in using temporal difference learning methods to attack problems of prediction and control. While these algorithms have been brought to bear on many problems, they remain poorly understood. It is the purpose of this thesis to further explore these algorithms, presenting a framework for viewing them and raising a number of practical issues and exploring those issues in the context of several case studies. This includes applying the TD(lambda) algorithm to: 1) learning to play tic-tac-toe from the outcome of self-play and of play against a perfectly-playing opponent and 2) learning simple one-dimensional segmentation tasks.

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The goal of this article is to reveal the computational structure of modern principle-and-parameter (Chomskian) linguistic theories: what computational problems do these informal theories pose, and what is the underlying structure of those computations? To do this, I analyze the computational complexity of human language comprehension: what linguistic representation is assigned to a given sound? This problem is factored into smaller, interrelated (but independently statable) problems. For example, in order to understand a given sound, the listener must assign a phonetic form to the sound; determine the morphemes that compose the words in the sound; and calculate the linguistic antecedent of every pronoun in the utterance. I prove that these and other subproblems are all NP-hard, and that language comprehension is itself PSPACE-hard.

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We contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of microelectromechanical systems (MEMS) devices. Deep reactive ion etch is commonly used in MEMS fabrication where high-aspect ratio features are to be produced in silicon. It is typical for many supposedly identical devices, perhaps of diameter 10 mm, to be etched simultaneously into one silicon wafer of diameter 150 mm. Etch non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and on local consumption of those species at the device, or die, level. An ion–neutral synergism model is constructed from data obtained from etching several layouts of differing pattern opening densities. Such a model is used to predict wafer-level variation with an r.m.s. error below 3%. This model is combined with a die-level model, which we have reported previously, on a MEMS layout. The two-level model is shown to enable prediction of both within-die and wafer-scale etch rate variation for arbitrary wafer loadings.