Mobile P2Ping: A Super-Peer based Structured P2P System Using a Fleet of City Buses

Recently, researchers have introduced the notion of super-peers to improve signaling efficiency as well as lookup performance of peer-to-peer (P2P) systems. In a separate development, recent works on applications of mobile ad hoc networks (MANET) have seen several proposals on utilizing mobile fleets such as city buses to deploy a mobile backbone infrastructure for communication and Internet access in a metropolitan environment. This paper further explores the possibility of deploying P2P applications such as content sharing and distributed computing, over this mobile backbone infrastructure. Specifically, we study how city buses may be deployed as a mobile system of super-peers. We discuss the main motivations behind our proposal, and outline in detail the design of a super-peer based structured P2P system using a fleet of city buses.

A Two-level Prediction Model for Deep Reactive Ion Etch (DRIE)

We contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of microelectromechanical systems (MEMS) devices. Deep reactive ion etch is commonly used in MEMS fabrication where high-aspect ratio features are to be produced in silicon. It is typical for many supposedly identical devices, perhaps of diameter 10 mm, to be etched simultaneously into one silicon wafer of diameter 150 mm. Etch non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and on local consumption of those species at the device, or die, level. An ion–neutral synergism model is constructed from data obtained from etching several layouts of differing pattern opening densities. Such a model is used to predict wafer-level variation with an r.m.s. error below 3%. This model is combined with a die-level model, which we have reported previously, on a MEMS layout. The two-level model is shown to enable prediction of both within-die and wafer-scale etch rate variation for arbitrary wafer loadings.