1 resultado para Uniform Surface Heat Flux
em Massachusetts Institute of Technology
Filtro por publicador
- KUPS-Datenbank - Universität zu Köln - Kölner UniversitätsPublikationsServer (1)
- AMS Tesi di Dottorato - Alm@DL - Università di Bologna (5)
- AMS Tesi di Laurea - Alm@DL - Università di Bologna (5)
- Aquatic Commons (1)
- ArchiMeD - Elektronische Publikationen der Universität Mainz - Alemanha (2)
- Archimer: Archive de l'Institut francais de recherche pour l'exploitation de la mer (2)
- Archive of European Integration (5)
- Aston University Research Archive (12)
- Biblioteca de Teses e Dissertações da USP (1)
- Biblioteca Digital da Produção Intelectual da Universidade de São Paulo (10)
- Biblioteca Digital da Produção Intelectual da Universidade de São Paulo (BDPI/USP) (44)
- BORIS: Bern Open Repository and Information System - Berna - Suiça (10)
- Brock University, Canada (3)
- Bucknell University Digital Commons - Pensilvania - USA (1)
- CentAUR: Central Archive University of Reading - UK (218)
- Cochin University of Science & Technology (CUSAT), India (15)
- Coffee Science - Universidade Federal de Lavras (1)
- Consorci de Serveis Universitaris de Catalunya (CSUC), Spain (16)
- CORA - Cork Open Research Archive - University College Cork - Ireland (1)
- CUNY Academic Works (1)
- Dalarna University College Electronic Archive (4)
- Digital Commons - Michigan Tech (6)
- Digital Commons at Florida International University (4)
- DigitalCommons - The University of Maine Research (5)
- Doria (National Library of Finland DSpace Services) - National Library of Finland, Finland (42)
- DRUM (Digital Repository at the University of Maryland) (6)
- Glasgow Theses Service (1)
- Greenwich Academic Literature Archive - UK (1)
- Illinois Digital Environment for Access to Learning and Scholarship Repository (2)
- INSTITUTO DE PESQUISAS ENERGÉTICAS E NUCLEARES (IPEN) - Repositório Digital da Produção Técnico Científica - BibliotecaTerezine Arantes Ferra (1)
- Instituto Politécnico de Bragança (1)
- Iowa Publications Online (IPO) - State Library, State of Iowa (Iowa), United States (1)
- Massachusetts Institute of Technology (1)
- Memorial University Research Repository (2)
- Nottingham eTheses (1)
- Publishing Network for Geoscientific & Environmental Data (317)
- QSpace: Queen's University - Canada (1)
- QUB Research Portal - Research Directory and Institutional Repository for Queen's University Belfast (3)
- Repositório Alice (Acesso Livre à Informação Científica da Embrapa / Repository Open Access to Scientific Information from Embrapa) (4)
- Repositório Científico da Universidade de Évora - Portugal (1)
- Repositório Científico do Instituto Politécnico de Lisboa - Portugal (1)
- Repositório Institucional da Universidade de Brasília (1)
- Repositorio Institucional de la Universidad de Málaga (1)
- Repositório Institucional UNESP - Universidade Estadual Paulista "Julio de Mesquita Filho" (65)
- Repositorio Institucional Universidad de Medellín (1)
- RUN (Repositório da Universidade Nova de Lisboa) - FCT (Faculdade de Cienecias e Technologia), Universidade Nova de Lisboa (UNL), Portugal (4)
- Scielo Saúde Pública - SP (16)
- Scientific Open-access Literature Archive and Repository (1)
- Universidad de Alicante (3)
- Universidad Politécnica de Madrid (27)
- Universidade Complutense de Madrid (3)
- Universidade do Minho (2)
- Universidade Federal de Uberlândia (1)
- Universidade Federal do Pará (5)
- Universidade Federal do Rio Grande do Norte (UFRN) (7)
- Universitat de Girona, Spain (2)
- Universitätsbibliothek Kassel, Universität Kassel, Germany (3)
- Université de Lausanne, Switzerland (13)
- Université de Montréal (1)
- Université de Montréal, Canada (10)
- Université Laval Mémoires et thèses électroniques (1)
- University of Michigan (8)
- University of Queensland eSpace - Australia (40)
- University of Washington (3)
Resumo:
One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come.