A Two-level Prediction Model for Deep Reactive Ion Etch (DRIE)

We contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of microelectromechanical systems (MEMS) devices. Deep reactive ion etch is commonly used in MEMS fabrication where high-aspect ratio features are to be produced in silicon. It is typical for many supposedly identical devices, perhaps of diameter 10 mm, to be etched simultaneously into one silicon wafer of diameter 150 mm. Etch non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and on local consumption of those species at the device, or die, level. An ion–neutral synergism model is constructed from data obtained from etching several layouts of differing pattern opening densities. Such a model is used to predict wafer-level variation with an r.m.s. error below 3%. This model is combined with a die-level model, which we have reported previously, on a MEMS layout. The two-level model is shown to enable prediction of both within-die and wafer-scale etch rate variation for arbitrary wafer loadings.

Face Detection in Still Gray Images

We present a trainable system for detecting frontal and near-frontal views of faces in still gray images using Support Vector Machines (SVMs). We first consider the problem of detecting the whole face pattern by a single SVM classifer. In this context we compare different types of image features, present and evaluate a new method for reducing the number of features and discuss practical issues concerning the parameterization of SVMs and the selection of training data. The second part of the paper describes a component-based method for face detection consisting of a two-level hierarchy of SVM classifers. On the first level, component classifers independently detect components of a face, such as the eyes, the nose, and the mouth. On the second level, a single classifer checks if the geometrical configuration of the detected components in the image matches a geometrical model of a face.

A Comparison of Hardware Implementations for Low-Level Vision Algorithms

Early and intermediate vision algorithms, such as smoothing and discontinuity detection, are often implemented on general-purpose serial, and more recently, parallel computers. Special-purpose hardware implementations of low-level vision algorithms may be needed to achieve real-time processing. This memo reviews and analyzes some hardware implementations of low-level vision algorithms. Two types of hardware implementations are considered: the digital signal processing chips of Ruetz (and Broderson) and the analog VLSI circuits of Carver Mead. The advantages and disadvantages of these two approaches for producing a general, real-time vision system are considered.

Task-Level Robot Learning

We are investigating how to program robots so that they learn from experience. Our goal is to develop principled methods of learning that can improve a robot's performance of a wide range of dynamic tasks. We have developed task-level learning that successfully improves a robot's performance of two complex tasks, ball-throwing and juggling. With task- level learning, a robot practices a task, monitors its own performance, and uses that experience to adjust its task-level commands. This learning method serves to complement other approaches, such as model calibration, for improving robot performance.