2 resultados para Packaging.

em Massachusetts Institute of Technology


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As multiprocessor system size scales upward, two important aspects of multiprocessor systems will generally get worse rather than better: (1) interprocessor communication latency will increase and (2) the probability that some component in the system will fail will increase. These problems can prevent us from realizing the potential benefits of large-scale multiprocessing. In this report we consider the problem of designing networks which simultaneously minimize communication latency while maximizing fault tolerance. Using a synergy of techniques including connection topologies, routing protocols, signalling techniques, and packaging technologies we assemble integrated, system-level solutions to this network design problem.

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This thesis describes the design and implementation of an integrated circuit and associated packaging to be used as the building block for the data routing network of a large scale shared memory multiprocessor system. A general purpose multiprocessor depends on high-bandwidth, low-latency communications between computing elements. This thesis describes the design and construction of RN1, a novel self-routing, enhanced crossbar switch as a CMOS VLSI chip. This chip provides the basic building block for a scalable pipelined routing network with byte-wide data channels. A series of RN1 chips can be cascaded with no additional internal network components to form a multistage fault-tolerant routing switch. The chip is designed to operate at clock frequencies up to 100Mhz using Hewlett-Packard's HP34 $1.2\\mu$ process. This aggressive performance goal demands that special attention be paid to optimization of the logic architecture and circuit design.