Ameliorating the Overhead of Dynamic Optimization

Dynamic optimization has several key advantages. This includes the ability to work on binary code in the absence of sources and to perform optimization across module boundaries. However, it has a significant disadvantage viz-a-viz traditional static optimization: it has a significant runtime overhead. There can be performance gain only if the overhead can be amortized. In this paper, we will quantitatively analyze the runtime overhead introduced by a dynamic optimizer, DynamoRIO. We found that the major overhead does not come from the optimizer's operation. Instead, it comes from the extra code in the code cache added by DynamoRIO. After a detailed analysis, we will propose a method of trace construction that ameliorate the overhead introduced by the dynamic optimizer, thereby reducing the runtime overhead of DynamoRIO. We believe that the result of the study as well as the proposed solution is applicable to other scenarios such as dynamic code translation and managed execution that utilizes a framework similar to that of dynamic optimization.

Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds

High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8].