7 resultados para Multi-view geometry

em Massachusetts Institute of Technology


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We present an image-based approach to infer 3D structure parameters using a probabilistic "shape+structure'' model. The 3D shape of a class of objects may be represented by sets of contours from silhouette views simultaneously observed from multiple calibrated cameras. Bayesian reconstructions of new shapes can then be estimated using a prior density constructed with a mixture model and probabilistic principal components analysis. We augment the shape model to incorporate structural features of interest; novel examples with missing structure parameters may then be reconstructed to obtain estimates of these parameters. Model matching and parameter inference are done entirely in the image domain and require no explicit 3D construction. Our shape model enables accurate estimation of structure despite segmentation errors or missing views in the input silhouettes, and works even with only a single input view. Using a dataset of thousands of pedestrian images generated from a synthetic model, we can perform accurate inference of the 3D locations of 19 joints on the body based on observed silhouette contours from real images.

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Statistical shape and texture appearance models are powerful image representations, but previously had been restricted to 2D or simple 3D shapes. In this paper we present a novel 3D morphable model based on image-based rendering techniques, which can represent complex lighting conditions, structures, and surfaces. We describe how to construct a manifold of the multi-view appearance of an object class using light fields and show how to match a 2D image of an object to a point on this manifold. In turn we use the reconstructed light field to render novel views of the object. Our technique overcomes the limitations of polygon based appearance models and uses light fields that are acquired in real-time.

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Recovering a volumetric model of a person, car, or other object of interest from a single snapshot would be useful for many computer graphics applications. 3D model estimation in general is hard, and currently requires active sensors, multiple views, or integration over time. For a known object class, however, 3D shape can be successfully inferred from a single snapshot. We present a method for generating a ``virtual visual hull''-- an estimate of the 3D shape of an object from a known class, given a single silhouette observed from an unknown viewpoint. For a given class, a large database of multi-view silhouette examples from calibrated, though possibly varied, camera rigs are collected. To infer a novel single view input silhouette's virtual visual hull, we search for 3D shapes in the database which are most consistent with the observed contour. The input is matched to component single views of the multi-view training examples. A set of viewpoint-aligned virtual views are generated from the visual hulls corresponding to these examples. The 3D shape estimate for the input is then found by interpolating between the contours of these aligned views. When the underlying shape is ambiguous given a single view silhouette, we produce multiple visual hull hypotheses; if a sequence of input images is available, a dynamic programming approach is applied to find the maximum likelihood path through the feasible hypotheses over time. We show results of our algorithm on real and synthetic images of people.

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Three-dimensional models which contain both geometry and texture have numerous applications such as urban planning, physical simulation, and virtual environments. A major focus of computer vision (and recently graphics) research is the automatic recovery of three-dimensional models from two-dimensional images. After many years of research this goal is yet to be achieved. Most practical modeling systems require substantial human input and unlike automatic systems are not scalable. This thesis presents a novel method for automatically recovering dense surface patches using large sets (1000's) of calibrated images taken from arbitrary positions within the scene. Physical instruments, such as Global Positioning System (GPS), inertial sensors, and inclinometers, are used to estimate the position and orientation of each image. Essentially, the problem is to find corresponding points in each of the images. Once a correspondence has been established, calculating its three-dimensional position is simply a matter of geometry. Long baseline images improve the accuracy. Short baseline images and the large number of images greatly simplifies the correspondence problem. The initial stage of the algorithm is completely local and scales linearly with the number of images. Subsequent stages are global in nature, exploit geometric constraints, and scale quadratically with the complexity of the underlying scene. We describe techniques for: 1) detecting and localizing surface patches; 2) refining camera calibration estimates and rejecting false positive surfels; and 3) grouping surface patches into surfaces and growing the surface along a two-dimensional manifold. We also discuss a method for producing high quality, textured three-dimensional models from these surfaces. Some of the most important characteristics of this approach are that it: 1) uses and refines noisy calibration estimates; 2) compensates for large variations in illumination; 3) tolerates significant soft occlusion (e.g. tree branches); and 4) associates, at a fundamental level, an estimated normal (i.e. no frontal-planar assumption) and texture with each surface patch.

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We present a new method for rendering novel images of flexible 3D objects from a small number of example images in correspondence. The strength of the method is the ability to synthesize images whose viewing position is significantly far away from the viewing cone of the example images ("view extrapolation"), yet without ever modeling the 3D structure of the scene. The method relies on synthesizing a chain of "trilinear tensors" that governs the warping function from the example images to the novel image, together with a multi-dimensional interpolation function that synthesizes the non-rigid motions of the viewed object from the virtual camera position. We show that two closely spaced example images alone are sufficient in practice to synthesize a significant viewing cone, thus demonstrating the ability of representing an object by a relatively small number of model images --- for the purpose of cheap and fast viewers that can run on standard hardware.

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The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

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The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.