Maygen: A Symbolic Debugger Generation System

With the development of high-level languages for new computer architectures comes the need for appropriate debugging tools as well. One method for meeting this need would be to develop, from scratch, a symbolic debugger with the introduction of each new language implementation for any given architecture. This, however, seems to require unnecessary duplication of effort among developers. This paper describes Maygen, a "debugger generation system," designed to efficiently provide the desired language-dependent and architecture-dependent debuggers. A prototype of the Maygen system has been implemented and is able to handle the semantically different languages of C and OPAL.

Parallel Coupled Micro-Macro Actuators

This thesis presents a new actuator system consisting of a micro-actuator and a macro-actuator coupled in parallel via a compliant transmission. The system is called the Parallel Coupled Micro-Macro Actuator, or PaCMMA. In this system, the micro-actuator is capable of high bandwidth force control due to its low mass and direct-drive connection to the output shaft. The compliant transmission of the macro-actuator reduces the impedance (stiffness) at the output shaft and increases the dynamic range of force. Performance improvement over single actuator systems was expected in force control, impedance control, force distortion and reduction of transient impact forces. A set of quantitative measures is proposed and the actuator system is evaluated against them: Force Control Bandwidth, Position Bandwidth, Dynamic Range, Impact Force, Impedance ("Backdriveability'"), Force Distortion and Force Performance Space. Several theoretical performance limits are derived from the saturation limits of the system. A control law is proposed and control system performance is compared to the theoretical limits. A prototype testbed was built using permanenent magnet motors and an experimental comparison was performed between this actuator concept and two single actuator systems. The following performance was observed: Force bandwidth of 56Hz, Torque Dynamic Range of 800:1, Peak Torque of 1040mNm, Minimum Torque of 1.3mNm. Peak Impact Force was reduced by an order of magnitude. Distortion at small amplitudes was reduced substantially. Backdriven impedance was reduced by 2-3 orders of magnitude. This actuator system shows promise for manipulator design as well as psychophysical tests of human performance.

Effects of Platinum on NiPtSiGe/n-SiGe and NiPtSi/n-Si Schottky Contacts

Solid phase reaction of NiPt/Si and NiPt/SiGe is one of the key issues for silicide (germanosilicide) technology. Especially, the NiPtSiGe, in which four elements are involved, is a very complex system. As a result, a detailed study is necessary for the interfacial reaction between NiPt alloy film and SiGe substrate. Besides using traditional material characterization techniques, characterization of Schottky diode is a good measure to detect the interface imperfections or defects, which are not easy to be found on large area blanket samples. The I-V characteristics of 10nm Ni(Pt=0, 5, 10 at.%) germanosilicides/n-Si₀/₇Ge₀.₃ and silicides/n-Si contact annealed at 400 and 500°C were studied. For Schottky contact on n-Si, with the addition of Pt in the Ni(Pt) alloy, the Schottky barrier height (SBH) increases greatly. With the inclusion of a 10% Pt, SBH increases ~0.13 eV. However, for the Schottky contacts on SiGe, with the addition of 10% Pt, the increase of SBH is only ~0.04eV. This is explained by pinning of the Fermi level. The forward I-V characteristics of 10nm Ni(Pt=0, 5, 10 at.%)SiGe/SiGe contacts annealed at 400°C were investigated in the temperature range from 93 to 300K. At higher temperature (>253K) and larger bias at low temperature (<253K), the I-V curves can be well explained by a thermionic emission model. At lower temperature, excess currents at lower forward bias region occur, which can be explained by recombination/generation or patches due to inhomogenity of SBH with pinch-off model or a combination of the above mechanisms.

Poly-Si₁₋xGex Film Growth for Ni Germanosilicided Metal Gate

Scaling down of the CMOS technology requires thinner gate dielectric to maintain high performance. However, due to the depletion of poly-Si gate, it is difficult to reduce the gate thickness further especially for sub-65 nm CMOS generation. Fully silicidation metal gate (FUSI) is one of the most promising solutions. Furthermore, FUSI metal gate reduces gate-line sheet resistance, prevents boron penetration to channels, and has good process compatibility with high-k gate dielectric. Poly-SiGe gate technology is another solution because of its enhancement of boron activation and compatibility with the conventional CMOS process. Combination of these two technologies for the formation of fully germanosilicided metal gate makes the approach very attractive. In this paper, the deposition of undoped Poly-Si₁₋xGex (0 < x < 30% ) films onto SiO₂ in a low pressure chemical vapor deposition (LPCVD) system is described. Detailed growth conditions and the characterization of the grown films are presented.

Design and Development of 3-DOF Modular Micro Parallel Kinematic Manipulator

This paper presents the research and development of a 3-legged micro Parallel Kinematic Manipulator (PKM) for positioning in micro-machining and assembly operations. The structural characteristics associated with parallel manipulators are evaluated and the PKMs with translational and rotational movements are identified. Based on these identifications, a hybrid 3-UPU (Universal Joint-Prismatic Joint-Universal Joint) parallel manipulator is designed and fabricated. The principles of the operation and modeling of this micro PKM is largely similar to a normal size Stewart Platform (SP). A modular design methodology is introduced for the construction of this micro PKM. Calibration results of this hybrid 3-UPU PKM are discussed in this paper.

Investigation of aspect ratio of hole drilling from micro to nanoscale via focused ion beam fine milling

Holes with different sizes from microscale to nanoscale were directly fabricated by focused ion beam (FIB) milling in this paper. Maximum aspect ratio of the fabricated holes can be 5:1 for the hole with large size with pure FIB milling, 10:1 for gas assistant etching, and 1:1 for the hole with size below 100 nm. A phenomenon of volume swell at the boundary of the hole was observed. The reason maybe due to the dose dependence of the effective sputter yield in low intensity Gaussian beam tail regions and redeposition. Different materials were used to investigate variation of the aspect ratio. The results show that for some special material, such as Ni-Be, the corresponding aspect ratio can reach 13.8:1 with Cl₂ assistant etching, but only 0.09:1 for Si(100) with single scan of the FIB.

Micro-layered-photolithography for Micro-Fabrication and Micro-Molding

A novel process based on the principle of layered photolithography has been proposed and tested for making real three-dimensional micro-structures. An experimental setup was designed and built for doing experiments on this micro-fabrication process. An ultraviolet (UV) excimer laser at the wavelength of 248 nm was used as the light source and a single piece of photo-mask carrying a series of two dimensional (2D) patterns sliced from a three dimensional (3D) micro-part was employed for the photolithography process. The experiments were conducted on the solidification of liquid photopolymer from single layer to multiple layers. The single-layer photolithography experiments showed that certain photopolymers could be applied for the 3D micro-fabrication, and solid layers with sharp shapes could be formed from the liquid polymer identified. By using a unique alignment technique, multiple layers of photolithography was successfully realized for a micro-gear with features at 60 microns. Electroforming was also conducted for converting the photopolymer master to a metal cavity of the micro-gear, which proved that the process is feasible for micro-molding.

Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds

High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8].

Process Variability in Micro-Embossing

A promising technique for the large-scale manufacture of micro-fluidic devices and photonic devices is hot embossing of polymers such as PMMA. Micro-embossing is a deformation process where the workpiece material is heated to permit easier material flow and then forced over a planar patterned tool. While there has been considerable, attention paid to process feasibility very little effort has been put into production issues such as process capability and eventual process control. In this paper, we present initial studies aimed at identifying the origins and magnitude of variability for embossing features at the micron scale in PMMA. Test parts with features ranging from 3.5- 630 µm wide and 0.9 µm deep were formed. Measurements at this scale proved very difficult, and only atomic force microscopy was able to provide resolution sufficient to identify process variations. It was found that standard deviations of widths at the 3-4 µm scale were on the order of 0.5 µm leading to a coefficient of variation as high as 13%. Clearly, the transition from test to manufacturing for this process will require understanding the causes of this variation and devising control methods to minimize its magnitude over all types of parts.

The Inertio-Elastic Planar Entry Flow of Low-Viscosity Elastic Fluids in Micro-fabricated Geometries

The non-Newtonian flow of dilute aqueous polyethylene oxide (PEO) solutions through microfabricated planar abrupt contraction-expansions is investigated. The contraction geometries are fabricated from a high-resolution chrome mask and cross-linked PDMS gels using the tools of soft-lithography. The small length scales and high deformation rates in the contraction throat lead to significant extensional flow effects even with dilute polymer solutions having time constants on the order of milliseconds. The dimensionless extra pressure drop across the contraction increases by more than 200% and is accompanied by significant upstream vortex growth. Streak photography and videomicroscopy using epifluorescent particles shows that the flow ultimately becomes unstable and three-dimensional. The moderate Reynolds numbers (0.03 ≤ Re ≤ 44) associated with these high Deborah number (0 ≤ De ≤ 600) microfluidic flows results in the exploration of new regions of the Re-De parameter space in which the effects of both elasticity and inertia can be observed. Understanding such interactions will be increasingly important in microfluidic applications involving complex fluids and can best be interpreted in terms of the elasticity number, El = De/Re, which is independent of the flow kinematics and depends only on the fluid rheology and the characteristic size of the device.