A Theory of Quantitative Inference Applied to a Mechanical Design Compiler

This thesis presents the ideas underlying a computer program that takes as input a schematic of a mechanical or hydraulic power transmission system, plus specifications and a utility function, and returns catalog numbers from predefined catalogs for the optimal selection of components implementing the design. Unlike programs for designing single components or systems, the program provides the designer with a high level "language" in which to compose new designs. It then performs some of the detailed design process. The process of "compilation" is based on a formalization of quantitative inferences about hierarchically organized sets of artifacts and operating conditions. This allows the design compilation without the exhaustive enumeration of alternatives.

The Control of Human Arm Movement Models and Mechanical Constraints

A serial-link manipulator may form a mobile closed kinematic chain when interacting with the environment, if it is redundant with respect to the task degrees of freedom (DOFs) at the endpoint. If the mobile closed chain assumes a number of configurations, then loop consistency equations permit the manipulator and task kinematics to be calibrated simultaneously using only the joint angle readings; endpoint sensing is not required. Example tasks include a fixed endpoint (0 DOF task), the opening of a door (1 DOF task), and point contact (3 DOF task). Identifiability conditions are derived for these various tasks.

Improving Multi-class Text Classification with Naive Bayes

There are numerous text documents available in electronic form. More and more are becoming available every day. Such documents represent a massive amount of information that is easily accessible. Seeking value in this huge collection requires organization; much of the work of organizing documents can be automated through text classification. The accuracy and our understanding of such systems greatly influences their usefulness. In this paper, we seek 1) to advance the understanding of commonly used text classification techniques, and 2) through that understanding, improve the tools that are available for text classification. We begin by clarifying the assumptions made in the derivation of Naive Bayes, noting basic properties and proposing ways for its extension and improvement. Next, we investigate the quality of Naive Bayes parameter estimates and their impact on classification. Our analysis leads to a theorem which gives an explanation for the improvements that can be found in multiclass classification with Naive Bayes using Error-Correcting Output Codes. We use experimental evidence on two commonly-used data sets to exhibit an application of the theorem. Finally, we show fundamental flaws in a commonly-used feature selection algorithm and develop a statistics-based framework for text feature selection. Greater understanding of Naive Bayes and the properties of text allows us to make better use of it in text classification.

Gait Analysis for Classification

This thesis describes a representation of gait appearance for the purpose of person identification and classification. This gait representation is based on simple localized image features such as moments extracted from orthogonal view video silhouettes of human walking motion. A suite of time-integration methods, spanning a range of coarseness of time aggregation and modeling of feature distributions, are applied to these image features to create a suite of gait sequence representations. Despite their simplicity, the resulting feature vectors contain enough information to perform well on human identification and gender classification tasks. We demonstrate the accuracy of recognition on gait video sequences collected over different days and times and under varying lighting environments. Each of the integration methods are investigated for their advantages and disadvantages. An improved gait representation is built based on our experiences with the initial set of gait representations. In addition, we show gender classification results using our gait appearance features, the effect of our heuristic feature selection method, and the significance of individual features.

Multiclass Classification of SRBCTs

A novel approach to multiclass tumor classification using Artificial Neural Networks (ANNs) was introduced in a recent paper cite{Khan2001}. The method successfully classified and diagnosed small, round blue cell tumors (SRBCTs) of childhood into four distinct categories, neuroblastoma (NB), rhabdomyosarcoma (RMS), non-Hodgkin lymphoma (NHL) and the Ewing family of tumors (EWS), using cDNA gene expression profiles of samples that included both tumor biopsy material and cell lines. We report that using an approach similar to the one reported by Yeang et al cite{Yeang2001}, i.e. multiclass classification by combining outputs of binary classifiers, we achieved equal accuracy with much fewer features. We report the performances of 3 binary classifiers (k-nearest neighbors (kNN), weighted-voting (WV), and support vector machines (SVM)) with 3 feature selection techniques (Golub's Signal to Noise (SN) ratios cite{Golub99}, Fisher scores (FSc) and Mukherjee's SVM feature selection (SVMFS))cite{Sayan98}.

Improving Multiclass Text Classification with the Support Vector Machine

We compare Naive Bayes and Support Vector Machines on the task of multiclass text classification. Using a variety of approaches to combine the underlying binary classifiers, we find that SVMs substantially outperform Naive Bayes. We present full multiclass results on two well-known text data sets, including the lowest error to date on both data sets. We develop a new indicator of binary performance to show that the SVM's lower multiclass error is a result of its improved binary performance. Furthermore, we demonstrate and explore the surprising result that one-vs-all classification performs favorably compared to other approaches even though it has no error-correcting properties.

Visual Segmentation without Classification in a Model of the Primary Visual Cortex

Stimuli outside classical receptive fields significantly influence the neurons' activities in primary visual cortex. We propose that such contextual influences are used to segment regions by detecting the breakdown of homogeneity or translation invariance in the input, thus computing global region boundaries using local interactions. This is implemented in a biologically based model of V1, and demonstrated in examples of texture segmentation and figure-ground segregation. By contrast with traditional approaches, segmentation occurs without classification or comparison of features within or between regions and is performed by exactly the same neural circuit responsible for the dual problem of the grouping and enhancement of contours.

From Regression to Classification in Support Vector Machines

We study the relation between support vector machines (SVMs) for regression (SVMR) and SVM for classification (SVMC). We show that for a given SVMC solution there exists a SVMR solution which is equivalent for a certain choice of the parameters. In particular our result is that for $epsilon$ sufficiently close to one, the optimal hyperplane and threshold for the SVMC problem with regularization parameter C_c are equal to (1-epsilon)^{- 1} times the optimal hyperplane and threshold for SVMR with regularization parameter C_r = (1-epsilon)C_c. A direct consequence of this result is that SVMC can be seen as a special case of SVMR.

Validating Co-Training Models for Web Image Classification

Co-training is a semi-supervised learning method that is designed to take advantage of the redundancy that is present when the object to be identified has multiple descriptions. Co-training is known to work well when the multiple descriptions are conditional independent given the class of the object. The presence of multiple descriptions of objects in the form of text, images, audio and video in multimedia applications appears to provide redundancy in the form that may be suitable for co-training. In this paper, we investigate the suitability of utilizing text and image data from the Web for co-training. We perform measurements to find indications of conditional independence in the texts and images obtained from the Web. Our measurements suggest that conditional independence is likely to be present in the data. Our experiments, within a relevance feedback framework to test whether a method that exploits the conditional independence outperforms methods that do not, also indicate that better performance can indeed be obtained by designing algorithms that exploit this form of the redundancy when it is present.

Facilitating Mechanical Design with Augmented Reality

By enhancing a real scene with computer generated objects, Augmented Reality (AR), has proven itself as a valuable Human-Computer Interface (HCI) in numerous application areas such as medical, military, entertainment and manufacturing. It enables higher performance of on-site tasks with seamless presentation of up-to-date, task-related information to the users during the operation. AR has potentials in design because the current interface provided by Computer-aided Design (CAD) packages is less intuitive and reports show that the presence of physical objects help design thinking and communication. This research explores the use of AR to improve the efficiency of a design process, specifically in mechanical design.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

Non-linear mechanical behavior of the elastomer polydimethylsiloxane (PDMS) used in the manufacture of microfluidic devices

Polydimethylsiloxane (PDMS) is the elastomer of choice to create a variety of microfluidic devices by soft lithography techniques (eg., [1], [2], [3], [4]). Accurate and reliable design, manufacture, and operation of microfluidic devices made from PDMS, require a detailed characterization of the deformation and failure behavior of the material. This paper discusses progress in a recently-initiated research project towards this goal. We have conducted large-deformation tension and compression experiments on traditional macroscale specimens, as well as microscale tension experiments on thin-film (≈ 50µm thickness) specimens of PDMS with varying ratios of monomer:curing agent (5:1, 10:1, 20:1). We find that the stress-stretch response of these materials shows significant variability, even for nominally identically prepared specimens. A non-linear, large-deformation rubber-elasticity model [5], [6] is applied to represent the behavior of PDMS. The constitutive model has been implemented in a finite-element program [7] to aid the design of microfluidic devices made from this material. As a first attempt towards the goal of estimating the non-linear material parameters for PDMS from indentation experiments, we have conducted micro-indentation experiments using a spherical indenter-tip, and carried out corresponding numerical simulations to verify how well the numerically-predicted P(load-h(depth of indentation) curves compare with the corresponding experimental measurements. The results are encouraging, and show the possibility of estimating the material parameters for PDMS from relatively simple micro-indentation experiments, and corresponding numerical simulations.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.