Forecasting Global Temperature Variations by Neural Networks

Global temperature variations between 1861 and 1984 are forecast usingsregularization networks, multilayer perceptrons and linearsautoregression. The regularization network, optimized by stochasticsgradient descent associated with colored noise, gives the bestsforecasts. For all the models, prediction errors noticeably increasesafter 1965. These results are consistent with the hypothesis that thesclimate dynamics is characterized by low-dimensional chaos and thatsthe it may have changed at some point after 1965, which is alsosconsistent with the recent idea of climate change.s

Shape Recipes: Scene Representations that Refer to the Image

The goal of low-level vision is to estimate an underlying scene, given an observed image. Real-world scenes (e.g., albedos or shapes) can be very complex, conventionally requiring high dimensional representations which are hard to estimate and store. We propose a low-dimensional representation, called a scene recipe, that relies on the image itself to describe the complex scene configurations. Shape recipes are an example: these are the regression coefficients that predict the bandpassed shape from bandpassed image data. We describe the benefits of this representation, and show two uses illustrating their properties: (1) we improve stereo shape estimates by learning shape recipes at low resolution and applying them at full resolution; (2) Shape recipes implicitly contain information about lighting and materials and we use them for material segmentation.

Context-Based Vision System for Place and Object Recognition

While navigating in an environment, a vision system has to be able to recognize where it is and what the main objects in the scene are. In this paper we present a context-based vision system for place and object recognition. The goal is to identify familiar locations (e.g., office 610, conference room 941, Main Street), to categorize new environments (office, corridor, street) and to use that information to provide contextual priors for object recognition (e.g., table, chair, car, computer). We present a low-dimensional global image representation that provides relevant information for place recognition and categorization, and how such contextual information introduces strong priors that simplify object recognition. We have trained the system to recognize over 60 locations (indoors and outdoors) and to suggest the presence and locations of more than 20 different object types. The algorithm has been integrated into a mobile system that provides real-time feedback to the user.

Contextual Influences on Saliency

This article describes a model for including scene/context priors in attention guidance. In the proposed scheme, visual context information can be available early in the visual processing chain, in order to modulate the saliency of image regions and to provide an efficient short cut for object detection and recognition. The scene is represented by means of a low-dimensional global description obtained from low-level features. The global scene features are then used to predict the probability of presence of the target object in the scene, and its location and scale, before exploring the image. Scene information can then be used to modulate the saliency of image regions early during the visual processing in order to provide an efficient short cut for object detection and recognition.

Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits

Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnects test structures were created by thermocompression bonding and the bond toughness was measured using the four-point test. The effects of bonding temperature, physical bonding and failure mechanisms were investigated. The surface effects on copper surface due to pre-bond clean (with glacial acetic acid) were also looked into. A maximum average bond toughness of approximately 35 J/m² was obtained bonding temperature 300 C.