Control of Vibration in Mechanical Systems Using Shaped Reference Inputs

Dynamic systems which undergo rapid motion can excite natural frequencies that lead to residual vibration at the end of motion. This work presents a method to shape force profiles that reduce excitation energy at the natural frequencies in order to reduce residual vibration for fast moves. Such profiles are developed using a ramped sinusoid function and its harmonics, choosing coefficients to reduce spectral energy at the natural frequencies of the system. To improve robustness with respect to parameter uncertainty, spectral energy is reduced for a range of frequencies surrounding the nominal natural frequency. An additional set of versine profiles are also constructed to permit motion at constant speed for velocity-limited systems. These shaped force profiles are incorporated into a simple closed-loop system with position and velocity feedback. The force input is doubly integrated to generate a shaped position reference for the controller to follow. This control scheme is evaluated on the MIT Cartesian Robot. The shaped inputs generate motions with minimum residual vibration when actuator saturation is avoided. Feedback control compensates for the effect of friction Using only a knowledge of the natural frequencies of the system to shape the force inputs, vibration can also be attenuated in modes which vibrate in directions other than the motion direction. When moving several axes, the use of shaped inputs allows minimum residual vibration even when the natural frequencies are dynamically changing by a limited amount.

Thermal control of electronics: Perspectives and prospects

One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come.