Control of Vibration in Mechanical Systems Using Shaped Reference Inputs

Dynamic systems which undergo rapid motion can excite natural frequencies that lead to residual vibration at the end of motion. This work presents a method to shape force profiles that reduce excitation energy at the natural frequencies in order to reduce residual vibration for fast moves. Such profiles are developed using a ramped sinusoid function and its harmonics, choosing coefficients to reduce spectral energy at the natural frequencies of the system. To improve robustness with respect to parameter uncertainty, spectral energy is reduced for a range of frequencies surrounding the nominal natural frequency. An additional set of versine profiles are also constructed to permit motion at constant speed for velocity-limited systems. These shaped force profiles are incorporated into a simple closed-loop system with position and velocity feedback. The force input is doubly integrated to generate a shaped position reference for the controller to follow. This control scheme is evaluated on the MIT Cartesian Robot. The shaped inputs generate motions with minimum residual vibration when actuator saturation is avoided. Feedback control compensates for the effect of friction Using only a knowledge of the natural frequencies of the system to shape the force inputs, vibration can also be attenuated in modes which vibrate in directions other than the motion direction. When moving several axes, the use of shaped inputs allows minimum residual vibration even when the natural frequencies are dynamically changing by a limited amount.

Summary of Research Conducted by the Manufacturing Systems Team 1994-2002

The Manufacturing Systems team was one of the research teams within the Lean Aerospace Initiative (LAI) whose goal was to document, analyze and communicate the design attributes and relationships that lead to significant performance improvements in manufacturing systems in the defense aerospace industry. This report will provide an integrated record of this research using the Production Operations Transition to Lean Roadmap as its organizing framework.

Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits

Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnects test structures were created by thermocompression bonding and the bond toughness was measured using the four-point test. The effects of bonding temperature, physical bonding and failure mechanisms were investigated. The surface effects on copper surface due to pre-bond clean (with glacial acetic acid) were also looked into. A maximum average bond toughness of approximately 35 J/m² was obtained bonding temperature 300 C.

Planning and Scheduling Decisions in Supply Chains with Multiple Supply Modes: An Integrated Approach

We address the problem of jointly determining shipment planning and scheduling decisions with the presence of multiple shipment modes. We consider long lead time, less expensive sea shipment mode, and short lead time but expensive air shipment modes. Existing research on multiple shipment modes largely address the short term scheduling decisions only. Motivated by an industrial problem where planning decisions are independent of the scheduling decisions, we investigate the benefits of integrating the two sets of decisions. We develop sequence of mathematical models to address the planning and scheduling decisions. Preliminary computational results indicate improved performance of the integrated approach over some of the existing policies used in real-life situations.